About 10 Trademarks found that are owned by Nano Dimension Technologies Ltd

Computer software for data analysis and computation and operating software for artificial intelligence, information technology, deep learning, machine learning, reinforcement learning, virtual reality, deep neural networks and adaptive systems; computer programs for implementing a computer programming language, and computer software development tools, for use in the fields of artificial intelligence, information technology, deep learning, machine learning, reinforcement learning, virtual reality, deep neural networks and adaptive systems; downloadable computer software applications for use in designing and developing artificial intelligence, information technology, deep learning, machine learning, reinforcement learning, virtual reality, deep neural networks and adaptive systems; computer software and computer programs for use in general purpose computation, manipulation of collections of data, data transformation, input/output, communications, graphics display, modeling and testing for use in the fields of artificial intelligence, information technology, deep learning, machine learning, reinforcement learning, virtual reality, deep neural networks and adaptive systems; Software for use in managing, controlling and operating robots and robotics equipment

DEEP CUBE

3d printing housing for inkjet printing 3d printers, inkjet 3d printers, inkjet printing machines for manufacturing of three-dimensional products, inkjet 3d printing machinery, machines and machine tools for additive manufacturing, particularly material jetting, polyjetting printing included in class 007

3D printing housing for LCD/DLP/SLA 3D printers, LCD/DLP/SLA 3D printers, LCD/DLP/SLA printing machines for manufacturing of threedimensional products, LCD/DLP/SLA 3D printing machinery, machines and machine tools for additive manufacturing, particularly material jetting, polyjetting, dlp/lcd 3d printing, selective laser melting, 3D DLP PRINTERS AND 3D (PRINTING) PENS INCLUDING IN CLASS 07

3D printing housing for LCD/DLP/SLA 3D printers, LCD/DLP/SLA 3D printers, LCD/DLP/SLA printing machines for manufacturing of three-dimensional products, LCD/DLP/SLA 3D printing machinery, machines and machine tools for additive manufacturing, particularly material jetting, polyjetting, dlp/lcd 3d printing, selective laser melting, 3D DLP PRINTERS AND 3D (PRINTING) PENS INCLUDING IN CLASS 07

insulating materials · insulating coating materials for use with printed circuit boards · insulating resin materials for liquid intermediate dielectric materials for use on build-up boards · insulating resin materials for dry film type intermediate dielectric materials for use on build-up boards · insulating coating materials for use with display panels · insulating solder mask for use with printed circuit boards · insulating protecting filling and plugging materials for use with holes of printed circuit boards · insulating coating materials for use with package application boards · insulating coating materials for use with flexible printed boards · dielectric material for use in three dimensional printing

prototype fabrication services in the nature of a service bureau, namely, building prototype parts to the order and specifications of others, manufacture of three-dimensional objects, namely, prototypes, models, patterns, molds, medical devices and finished goods, to the order and specification of others

modeling materials for use in three-dimensional modeling machines, namely, ceramic and metals in extruded, powder, liquid, rod, pellets or molded form, as well as polymers, waxes and elastomers in extruded, molded, powdered or jetted form

modeling materials for use in three-dimensional modeling machines, namely, ceramic and metals in extruded, powder, liquid, rod, pellets or molded form

prototype fabrication services in the nature of a service bureau, namely, building prototype parts to the order and specifications of others, manufacture of three-dimensional objects, namely, prototypes, models, patterns, molds, medical devices and finished goods, to the order and specification of others

Computer software; software platforms; Computer software for use in software development and implementation; computer software development tools; computer software for use in the field of medical, healthcare, construction, engineering, architecture, buildings, infrastructure, building materials, machinery and manufacturing, materials ; computer hardware; computer hardware and software for reading, receiving, analysing, configuring, processing, organising, data logging, interfacing, and transmitting data from a wireless sensor or wireless sensor network; computer software system that makes use of data obtained via wireless sensors to optimise costs, efficiency, productivity, safety, performance, waste and sustainability, planning, scheduling, logistics, design, delivery, construction, performance and operation of buildings and infrastructure, construction materials, machinery, tools, equipment, assets, people and processes; artificial intelligence (AI) hardware and software; software for use in connection with visualisation software; downloadable software for use in connection with workflow from start to finish of manufacturing; computer software for data virtualisation, data extraction, data integration, data indexing, data management, data consolidation, data migration, data configuration, data unification, data from the products use and quality assurance; software for quality assurance; software for optimisation of decisions in the full product lifecycle; machine learning software for analysis; optimisation software; software for the optimisation of technological research and development; recorded database management software for general use; computer software platforms for database management; configuration software nano-fluidic devices for genome analysis and visualisation components -nanofluidic devices; specialist software programs for use in the medical, healthcare, construction, engineering, architecture, buildings, infrastructure, building materials, machinery and manufacturing sectors; computer software for providing human machine interface and visualisation, communications over a network and between application programs, information management, logic programming, scheduling, simulation validation, archiving, logic and processed control, computer software for use in the design, operation and maintenance of automation processes

Common metals and their alloys, ores; non-electric cables and wires of common metal; metals and metal alloys and products thereof, namely, common metals, unwrought or semi-wrought; small items of metal hardware; metal materials for building and construction; unwrought and partly wrought common metals; aluminium wire; common metals in powder form; common metal powders used in manufacturing; metals in any form for use in 3D printing; metals in any form for additive manufacturing; metals in foil form for 3d printers; metals in powder form for 3d printers; metal leveling casters for use on manufacturing equipment and production machinery for use in the engineering and manufacturing industry; corrosion-resistant, acid-resistant and heat resistant flat products of stainless steel, nickel-based materials, titanium and titanium alloys

Custom additive manufacturing for others, Manufacture of hi-performance electronic devices for others, namely, custom-designed printed circuit boards, system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like PCB (SLP), Fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), interposers - fabricated using 3D printers; Manufacturing services for others in the field of hi-performance electronic devices (HI-PED), namely,; system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like PCB (SLP), Fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), and interposers

: integrated circuits, namely, system-in-package (SiP) electronics; micro electromechanical systems (MEMS); inertial MEMS; substrate-embedded systems; planar magnetic boards; mesh communication electronics; mmWave RF antennae PCB; antennae-in-chip (AiC); antennae-in-package (AiP); substrate-like PCB (SLP); Fan-in/Fan-out AiP (InFO-AiP); Package-in-package (PiP) electronics; integrated photonic devices; through Silicone via (TSV) devices; embedded multi-die interconnect bridge (EMIB) chips; monolithic microwave integrated circuits (MMIC); interposers; and technical manuals sold with the above goods