ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
failure to respond or late response
on 16 Nov 2021
Last Applicant/ Owned by
820 Albemarle St.
Wyckoff
VI
NJ
07481
Serial Number
90300115 filed on 05th Nov 2020
Registration Number
N/A
Filing Basis
1. use application currently
Disclaimer
NO DATA
NANOS
Custom additive manufacturing for others, Manufacture of hi-performance electronic devices for others, namely, custom-designed printed circuit boards, system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP) Read More
Classification Information
Class [040]
Treatment & Processing of Materials Services
Custom additive manufacturing for others, Manufacture of hi-performance electronic devices for others, namely, custom-designed printed circuit boards, system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like PCB (SLP), Fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), interposers - fabricated using 3D printers; Manufacturing services for others in the field of hi-performance electronic devices (HI-PED), namely,; system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like PCB (SLP), Fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), and interposers
First Use Date in General
20th Apr 2020
First Use Date in Commerce
20th Apr 2020
Mark Details
Serial Number
No 90300115
Mark Type
No Service Mark
Attorney Docket Number
No NND1002TM_US
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 16th Nov 2021 | ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND |
| 16th Nov 2021 | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE |
| 05th May 2021 | NON-FINAL ACTION WRITTEN |
| 05th May 2021 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| 05th May 2021 | NON-FINAL ACTION E-MAILED |
| 13th Apr 2021 | ASSIGNED TO EXAMINER |
| 05th Jan 2021 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM |
| 09th Nov 2020 | NEW APPLICATION ENTERED IN TRAM |