About 6 Trademarks found that are owned by LamInation Technology Inc.

MASS MOLDED MULTILAYER LAMINATES

CIRCUIT BOARD LAMINATES

THE MARK COMPRISES A FANCIFUL DEPICTION OF THE LETTERS "LTI".

Copper Clad Laminates Comprising an Insulative Substrate, Epoxy Resin and Outer Layers of Copper Foil

Resin Impregnated Glass Cloth Used for Printed Wiring or Multilayer Printed Wiring Boards which Are Used for Electronic Circuitry

CIRCUIT BOARD LAMINATES; MASS LAMINATIONMULTI-LAYER PANELS; PRE- PREG MATERIALS SUCH AS GLASS CLOTH IMPREGNATED WITH EXPOXY RESIN, FORMULATIONS AND MATERIALSFOR USE IN MAKING CIRCUIT BOARD LAMINATES; AND PRECISION DIGITAL EQUIPMENT FOR MEASURING THICKNESS, LENGTH, WEIGHT AND ADHESION OF LAMINATES

PREPARATIONS AND SUPPLY OF CIRCUIT BOARDLAMINATES AND MASS LAMINATED MULTI-LAYERPANELS INCLUDING THE FORMATION OF CIRCUITS THEREON TO CUSTOMER ORDER