Services
Trademarks
Protect your brand today
Register your Trademark
Post Filing Services
Trademark Protection
Patents
File a patent today
Start a Patent Application
Copyrights
Safeguard your creative ideas
Start a Copyright Application
Business
Incorporate your business today
Start a Business
Legal Forms for Business
Resources
Guest
Dead/Cancelled
CANCELLED - SECTION 8
CANCELLED - SECTION 8
section 8
on 25 Nov 1988
Last Applicant/ Owned by
2720 S. Main St.
Santa Ana
CA
92707
Serial Number
73162765 filed on 20th Mar 1978
Registration Number
1193497 registered on 13th Apr 1982
in the Principal Register
Filing Basis
1. use application currently
Disclaimer
NO DATA
HI-TEK
Copper Clad Laminates Comprising an Insulative Substrate, Epoxy Resin and Outer Layers of Copper Foil
Classification Information
Class [006]
Metal Products
Copper Clad Laminates Comprising an Insulative Substrate, Epoxy Resin and Outer Layers of Copper Foil
First Use Date in General
01st Nov 1976
First Use Date in Commerce
01st Nov 1976
Mark Details
Serial Number
No 73162765
Mark Type
No Service/Collective Mark
Attorney Docket Number
No
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 25th Nov 1988 | CANCELLED SEC. 8 (6-YR) |
| 13th Apr 1982 | REGISTERED-PRINCIPAL REGISTER |