About 15 Trademarks found that are owned by Kabushiki Kaisha Tokyo Seimitsu

Precision measuring machines, namely, wafer thickness measuring machine, digital length measuring machine, surface texture measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer [ ; Wafer inspection units ]

Metal working machines and tools, namely grinding machines, metal cutting machines; Semiconductor manufacturing equipment, namely wafer probing machine, wafer dicing machine, chemical mechanical grinders and back grinders; and machine parts therefor

Precision measuring machines, namely wafer thickness measuring machine, digital length measuring machine, surface texture measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, machine control gauge, electric micrometer, pneumatic micrometer; wafer inspection units

Metal working machines and tools, namely grinding machines, metal cutting machines; semiconductor manufacturing equipment, namely sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, and dicing machine, wafer inspection systems, chemical mechanical grinders and back grinders

The lining is a feature of the mark and does not indicate color.

Precision measuring machines, namely, non-contact flatness measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three dimensional measuring machine, coordinate measuring machine; data processing for coordinate measuring machines,displacement sensor, computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measurers; Optical apparatus/instruments, namely microscopes; electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines

Semiconductor manufacturing machines and systems, namely polishing machines of wafers

Precision measuring machines, namely, surface texture measuring machine, surface texture and contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine

Precision measuring machines, namely, surface texture measuring machine, surface texture and contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine

In the Statement, Column 2, lines 12-15, "; NETWORK SYSTEM COMPRISED OF COMPUTER HARDWARE AND SOFTWARE FOR WAFER PROBING MACHINES" should be deleted.

Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, dicing machine, and chemical mechanical planarizers; and machine parts therefor

Wafer manufacturing systems, Chemical mechanical planarizers, Polish grinders, Dicing machines

Coordinate measuring machines, Cylindrical form measuring instruments, digital length measurement instrument, Laser interferometers

Precision measuring machines, namely non-contact flatness measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three dimensional measuring machine, coordinate measuring machine; data processing for coordinate measuring machine, displacement sensor, computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measurers; optical apparatus/instruments, namely microscopes; electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; automatic distribution vending machines; network system comprised of computer hardware and software for wafer probing machines

STEEL DROP-BOXES FOR BUSINESS USE FOR HOME DELIVERY SERVICES, LAUNDRY SERVICES AND PHOTO PROCESSING SERVICES

The mark consists of the letter "S" in Sylphide in upper case, and the letters "ylphide" in Sylphide in lower case.

Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines

Rental of manufacturing apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Rental of measuring apparatus, namely-- Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines