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ACCRETECH
Dead/Cancelled
CANCELLED - SECTION 8

section 8

on 20 Jun 2014

Last Applicant/ Owned by

9-7-1, Shimorenjaku, Mitaka-shi

Tokyo

JP

1818515

Serial Number

78576649 filed on 28th Feb 2005

Registration Number

3334452 registered on 13th Nov 2007

in the Principal Register

Correspondent Address

Curtis B. Hamre

Danielle I. Mattessich

P.O. Box 2910

Minneapolis MN 55402-0910

Filing Basis

1. intent to use

Disclaimer

NO DATA

ACCRETECH

Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, dicing machine, and chemical mechanical planarizers; and machi Read More

Classification Information


Class [009]
Computer & Software Products & Electrical & Scientific Products


Precision measuring machines, namely non-contact flatness measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three-dimensional measuring machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; optical apparatus/instruments, namely microscopes; electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; automatic distribution vending machines [ ; network system comprised of computer hardware and software for wafer probing machines ]

Class [007]
Machinery Products


Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, dicing machine, and chemical mechanical planarizers; and machine parts therefor

Mark Details


Serial Number

No 78576649

Mark Type

No Service/Collective Mark

Attorney Docket Number

No 594.394-US-0

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

No

66A Current

No

Current Basis

No

No Basis

No

Legal History


Show more

Status DateAction Taken
20th Jun 2014CANCELLED SEC. 8 (6-YR)
29th Nov 2008CORRECTION UNDER SECTION 7 ¿ PROCESSED
27th May 2008ASSIGNED TO PARALEGAL
14th Apr 2008PAPER RECEIVED
14th Apr 2008SEC 7 REQUEST FILED
13th Nov 2007REGISTERED-PRINCIPAL REGISTER
28th Aug 2007PUBLISHED FOR OPPOSITION
08th Aug 2007NOTICE OF PUBLICATION
25th Jul 2007NOTICE OF ALLOWANCE CANCELLED
05th Jul 2007ATTORNEY REVIEW/DECISION ON AMENDMENT REQUIRED