About 19 Trademarks found that are owned by Ibg Immobilien Und Beteiligungs Gmbh

The mark consists of three letter "I's" depicted by black rectangles. In the body of the first letter "I," the word "INVENT" appears in white. In the body of the second letter "I," the word "INNOVATE" appears in white. In the body of the third letter "I," the word "IMPLEMENT" appears in white.

Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables

The mark consists of three letter "I's" depicted by black rectangles. The letters appear in black on a white background.

Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for testing, namely, testing machines for semiconductors, [ tensile testing machines, ] optical inspection apparatus for inspection of semiconductor materials; [ Electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, ] semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors [ ; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables ]

Scientific apparatus and instruments for microelectronics, for medical equipment techniques, biotechnology, microsystem techniques, semiconductor and nanotechnology, namely, exposure systems for 1X lithography applications, namely, mask aligners and contact and proximity printers and devices for joining one or multiple substrates temporarily or permanently, namely, substrate bonding systems comprised of UV-radiation/UV-light source devices, heaters, and pneumatic and hydraulic piston setups and spindles; surveying devices, electric, photographic, optical, measuring, signaling, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, in medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology, namely, front to backside alignment measurement systems including at least one of measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, computer hardware that can analyze the data and calculate misalignment values between the pattern on the front and backside; chips, integrated circuits; downloadable computer operation programs for use in the operation of microelectronics and semiconductor fabrication and processing apparatuses; peripheral equipment for computers; data processing units, data processing devices and computers; downloadable computer software for analyzing wafer bonding results and pattern alignment of substrates; scientific diagnosis devices in bio-chip format, namely, DNA microarrays, microfluidic chips, and protein microarrays comprising oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries, combinatorial substance libraries on chip surfaces for scientific purposes; electric systems for remote controlled industrial operational processes, namely, laboratory robots; protective masks and filters therefor for use with photographic and photolithographic equipment and photographic film processing; devices for telecommunications, namely, telegraphic transmitting apparatus, telecopying devices, and telephones; semiconductors; capillary reagent tubes for laboratory use; electric monitoring devices, namely, oscillographs, indicators, and surveying instruments; couplers being data processing equipment; furniture especially made for laboratories; laser for non-medical purposes; reading devices being data processing apparatus; measuring instruments, namely laser measuring devices; measuring devices, namely, laser measuring devices; material testing instruments and machines, namely, machines for testing bonding strength in bonded substrates; optical apparatus and instruments, namely, microscopes; photographic apparatus and instruments, namely, cameras; physical and chemical laboratory apparatus and instruments, namely, metrology tools, debonding tools based on chemical assisted debonding; precision measuring devices for measuring wafter curvatures, wafer warpages, structural misalignments, and run-out errors; projectors, namely, digital micromirror device (DMD) based illumination devices; protective clothing, in particular for protection against accidents in clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; range finders for photographic equipment

Machines and machine tools for microelectronics, for the production, treatment, transport, and processing of electronic components in the fields of medical equipment techniques technology, biotechnology, microsystem techniques technology, semiconductor technology, nanotechnology, wafer bonding technology, lithography equipment technology; machines for manufacturing electronic components and optical and technical devices, namely, active and passive electronical components in the nature of micro-electromechanical systems (MEMS), microchips, memory chips, diodes, namely, light-emitting diodes, transistors, and optical lenses; precision machines as well as spare parts for the same for use with semiconductor technology, microelectronics, medical equipment, biotechnology, microsystems, and nanotechnology; self-regulating pumps, namely, resist dispense pumps

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class

SMART NILE

Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering consultation services for others, in relation to methods and devices in the field of semiconductor technology

[ Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables ]

Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi- conductors; Structural machine parts and equipment for the aforesaid machines and apparatus, namely, fittings in the nature of couplings for machines, bearings, chucks, joints, and lubricating apparatus for the aforesaid machines and apparatus

BOND SCALE

Recorded computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, transistors, and wafers; Semiconductor testing apparatus; Semiconductor wafer testing apparatus; Tensile testing machines; Electronic apparatus for testing compression, strength, hardness and tensile characteristics of industrial materials; Optical inspection apparatus for industrial use; Optical inspection apparatus for inspection of semiconductor materials, namely, semiconductor wafers, reticles, and photomasks; Electronic apparatus for testing the electrical conductivity of semiconductor wafers; Ultrasonic equipment for testing and inspecting semiconductors; Metal strength testing machines; Probes for testing semiconductors; Electronic apparatus for testing compression, strength, hardness and tensile characteristics of industrial materials; structural parts and equipment for the aforesaid machines and apparatus, namely, batteries, electric wires and cables, fittings in the nature of couplings for machines, bearings, chucks, joints, and lubricating apparatus included in this class

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; Structural machine parts and equipment, namely, fittings in the nature of coupling for machines, bearings, chucks, joints and lubricating apparatus; Machines for manufacturing semiconductors; Semiconductor wafer processing machines; Semiconductor wafer processing equipment; Embossing printing machines

Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class

Scientific apparatus and instruments for microelectronics, microsystem techniques, semiconductor and nanotechnology, namely, cleaving, dividing, and separating apparatus; surveying devices, electric, photographic, optical, measuring, signal, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, microsystem techniques, and nanotechnology, namely, metrology tools; chips, integrated circuits; downloadable computer operation programs for use in the operation of cleaving, dividing, and separating of wafers or wafer stacks; peripheral equipment for computers; data processing units, data processing devices and computers; downloadable computer software for performing and controlling cleaving, dividing, and separating of wafers or wafer stacks; Downloadable computer operating software for use in processing plants for processing electronic circuits or semiconductors, especially of transistors or wafers; electric systems for remote controlled industrial operational processes comprising computer hardware and software for cleaving, dividing, and separating of wafers or wafer stacks; electric systems for manufacturing plants for microelectronics, microsystem techniques, and nanotechnology comprising computer hardware and software for cleaving, dividing, and separating of wafers or wafer stacks; devices for telecommunications, namely, mobile devise, mobile phones; devices for telegraphy, namely, telegraphic transmitting apparatus; telecopying devices; telephones; semiconductors; capillary reagent tubes for laboratory use; electric monitoring devices for monitoring semiconductor processes; couplers being data processing equipment; furniture especially made for laboratories; reading devices being data processing apparatus; measuring instruments for measuring bond strength and cleaving progress; measuring devices for measuring bond strength and cleaving progress; material testing instruments and machines, namely, for testing bond strength and cleaving progress; optical apparatus and instruments, namely, metrology tools, lithographic apparatuses, and aligner; physical and chemical laboratory apparatus and instruments, namely, devices and apparatuses for cleaving, dividing, and separating; precision measuring devices for measuring wafer and chip alignment; projectors, namely, laser devices; silicon wafers; probes for scientific purposes; spectroscopes; range finders for photographic equipment

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing, and lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers; parts and equipment for machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing, and lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers, installations for processing semiconductors, namely, severing a substrate, in particular for processing semiconductors under vacuum; installations for conveying semiconductors, namely, belt conveyors; installations and systems for the surface treatment of semiconductors, namely, sputtering devices; installations and systems for etching semiconductor surfaces comprising spray nozzles; installations for vaporizing semiconductor surfaces, in particular under vacuum (CVD processes); installations for conveying, providing, and processing semiconductors, namely, chucks; installations for conveying, processing, and providing photoelectric elements, namely, imprint modules; installations for conveying, processing, and providing flat screens, namely, imprint modules; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector, and for manufacturing light diodes; machines for semiconductor manufacturing; machines for memory chip manufacturing and memory chip assembly