NOTICE OF ALLOWANCE - ISSUED
issued
on 19 Nov 2024
Last Applicant/ Owned by
46816 LAKEVIEW BOULEVARD
FREMONT
CA
94538
Serial Number
97562597 filed on 24th Aug 2022
Registration Number
N/A
Correspondent Address
Lucas S. Michels
Filing Basis
1. intent to use current
Disclaimer
NO DATA
NANOCLEAVE
Technical consultancy relating to manufacturing methods and devices in the field of semi-conductor technology; research and development relating to manufacturing methods and devices in the field of semi-conductor technology; technical project planning relating to manufacturing methods and devices in the field of semi-conductor technology; Contract research and contract development, for others, in Read More
Classification Information
Class [042]
Computer & Software Services & Scientific Services
Technical consultancy relating to manufacturing methods and devices in the field of semi-conductor technology; research and development relating to manufacturing methods and devices in the field of semi-conductor technology; technical project planning relating to manufacturing methods and devices in the field of semi-conductor technology; Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micromechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices; Design and Development of Computer hardware and Software
First Use Date in General
N/A
First Use Date in Commerce
N/A
Class [009]
Computer & Software Products & Electrical & Scientific Products
Scientific apparatus and instruments for microelectronics, microsystem techniques, semiconductor and nanotechnology, namely, cleaving, dividing, and separating apparatus; surveying devices, electric, photographic, optical, measuring, signal, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, microsystem techniques, and nanotechnology, namely, metrology tools; chips, integrated circuits; downloadable computer operation programs for use in the operation of cleaving, dividing, and separating of wafers or wafer stacks; peripheral equipment for computers; data processing units, data processing devices and computers; downloadable computer software for performing and controlling cleaving, dividing, and separating of wafers or wafer stacks; Downloadable computer operating software for use in processing plants for processing electronic circuits or semiconductors, especially of transistors or wafers; electric systems for remote controlled industrial operational processes comprising computer hardware and software for cleaving, dividing, and separating of wafers or wafer stacks; electric systems for manufacturing plants for microelectronics, microsystem techniques, and nanotechnology comprising computer hardware and software for cleaving, dividing, and separating of wafers or wafer stacks; devices for telecommunications, namely, mobile devise, mobile phones; devices for telegraphy, namely, telegraphic transmitting apparatus; telecopying devices; telephones; semiconductors; capillary reagent tubes for laboratory use; electric monitoring devices for monitoring semiconductor processes; couplers being data processing equipment; furniture especially made for laboratories; reading devices being data processing apparatus; measuring instruments for measuring bond strength and cleaving progress; measuring devices for measuring bond strength and cleaving progress; material testing instruments and machines, namely, for testing bond strength and cleaving progress; optical apparatus and instruments, namely, metrology tools, lithographic apparatuses, and aligner; physical and chemical laboratory apparatus and instruments, namely, devices and apparatuses for cleaving, dividing, and separating; precision measuring devices for measuring wafer and chip alignment; projectors, namely, laser devices; silicon wafers; probes for scientific purposes; spectroscopes; range finders for photographic equipment
First Use Date in General
N/A
First Use Date in Commerce
N/A
Class [007]
Machinery Products
Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing, and lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers; parts and equipment for machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing, and lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers, installations for processing semiconductors, namely, severing a substrate, in particular for processing semiconductors under vacuum; installations for conveying semiconductors, namely, belt conveyors; installations and systems for the surface treatment of semiconductors, namely, sputtering devices; installations and systems for etching semiconductor surfaces comprising spray nozzles; installations for vaporizing semiconductor surfaces, in particular under vacuum (CVD processes); installations for conveying, providing, and processing semiconductors, namely, chucks; installations for conveying, processing, and providing photoelectric elements, namely, imprint modules; installations for conveying, processing, and providing flat screens, namely, imprint modules; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector, and for manufacturing light diodes; machines for semiconductor manufacturing; machines for memory chip manufacturing and memory chip assembly
First Use Date in General
N/A
First Use Date in Commerce
N/A
Mark Details
Serial Number
No 97562597
Mark Type
No Service Mark
Attorney Docket Number
No
44D Filed
Yes
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 03rd Dec 2024 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| 03rd Dec 2024 | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED |
| 03rd Dec 2024 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| 03rd Dec 2024 | TEAS CHANGE OF OWNER ADDRESS RECEIVED |
| 03rd Dec 2024 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| 27th Nov 2024 | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP |
| 19th Nov 2024 | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
| 08th Oct 2024 | OPPOSITION TERMINATED NO. 999999 |
| 08th Oct 2024 | TTAB RELEASE CASE TO TRADEMARKS |
| 08th Oct 2024 | OPPOSITION DISMISSED NO. 999999 |