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YOUTEC SUPPORT AND SERVICE
Dead/Abandoned
ABANDONED - NO STATEMENT OF USE FILED

no statement of use filed

on 14 Jan 2019

Last Applicant/ Owned by

956-1, Nishi-hirai, Nagareyama-shi

Chiba 270-0156

JP

Serial Number

87187723 filed on 29th Sep 2016

Registration Number

N/A

Correspondent Address

Rebeccah Gan

REBECCAH GAN

1030 15TH STREET, N.W.

SUITE 400 EAST

WASHINGTON, DC 20005

Filing Basis

1. intent to use

2. intent to use current

Disclaimer

NO DATA

YOUTEC SUPPORT AND SERVICE

(Based on Sections 1(b) and 44(e)): Electronic components, namely, piezoelectric switches and digital transmitters; Integrated electronic circuits and parts thereof; Power line electrical communication systems for transferring broadband data over electrical power lines comprised of computer hardware, software and modems; Electronic machines for identifying surface thickness of thin film applicatio Read More

Classification Information


Class [037]
Construction and Repair Services


(Based on Sections 1(b) and 44(e)): Repair and maintenance of machines for use in the manufacture of electronic semiconductor components; Repair and maintenance of semiconductor manufacturing machines; Repair and maintenance of chemical processing machines; Repair and maintenance of metalworking machines; Repair and maintenance of plastic processing machines; Repair and maintenance of industrial machines used to process physical properties of matter and energy, as well as chemical properties; Repair and maintenance of machines for depositing thin films of synthetic polymers on semiconductors, metal surfaces and electrical insulating materials; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for metal surface; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition for semiconductor manufacturing; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for plastic surface; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for glass surface; Repair and maintenance of ion plating apparatus for metal surface processing of semiconductor components; Repair and maintenance of ion plating apparatus for semiconductor manufacturing; Repair and maintenance of ion plating apparatus for plastic surface processing of semiconductor components; Repair and maintenance of ion plating apparatus for glass surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for metal surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for semiconductor manufacturing; Repair and maintenance of sputtering apparatus for plastic surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for glass surface processing of semiconductor components; Repair and maintenance of etching apparatus for metal surface processing; Repair and maintenance of etching apparatus for semiconductor manufacturing; Repair and maintenance of etching apparatus for plastic surface processing; Repair and maintenance of etching apparatus for glass surface processing; Repair and maintenance of vacuum evaporation apparatus for use in semiconductor manufacturing; Repair and maintenance of vacuum evaporation apparatus for metal surface preprocess in semiconductor manufacturing; Repair and maintenance of vacuum evaporation apparatus for plastic surface processing of semiconductor components; Repair and maintenance of vacuum evaporation apparatus for glass surface processing of semiconductor components

Class [001]
Chemical Products


(Based on Sections 1(b) and 44(e)): Conductive resin material, namely, unprocessed synthetic resins for use as an electrical conductor in the manufacture of semiconductors

Class [007]
Machinery Products


(Based on Section 1(b) only): Electronic components, namely, semiconductor wafers for use in the manufacture of semiconductors; Semiconductor manufacturing apparatus and systems, namely, semiconductor substrates and semiconductor wafers and parts thereof; Chemical processing machines, namely, separating machines, dissolving machines, extracting machines and parts thereof; Metalworking machines, namely, boring machines, bending machines, cutting machines and parts thereof; Plastic processing machines and parts thereof; Chemical processing machines for industrial use and parts thereof; Apparatus for forming thin film coatings for use in the manufacture of semiconductors and for processing metal surfaces and insulating materials, and parts thereof; Apparatus for depositing thin film coatings on metal surfaces by chemical vapor deposition processing and parts thereof; Apparatus for forming thin films for use in the manufacture of semiconductors using a chemical vapor deposition process, and parts thereof; Apparatus for forming thin films on plastic surfaces through a chemical vapor deposition process, and parts thereof; Apparatus for forming thin films on glass surfaces by a chemical vapor deposition process, and parts thereof; Industrial apparatus for processing ion plating applications of metal surfaces and parts thereof; Industrial apparatus for processing ion plating applications for use in semiconductor manufacturing and parts thereof; Industrial apparatus for processing ion plating applications for plastic surfaces, and parts thereof; Industrial apparatus for processing ion plating applications for glass surfaces, and parts thereof; Sputtering apparatus for metal surface processing and parts thereof, for industrial use; Sputtering apparatus for semiconductor manufacturing and parts thereof; Sputtering apparatus for plastic surface processing and parts thereof, for industrial use; Sputtering apparatus for glass surface processing and parts thereof, for industrial use; Etching apparatus for metal surface processing and parts thereof, for industrial use; Etching apparatus for semiconductor manufacturing and parts thereof; Etching apparatus for plastic surface processing and parts thereof, for industrial use; Etching apparatus for glass surface processing and parts thereof, for industrial use; Vacuum evaporation apparatus for surface treatment of semiconductors and parts thereof; Vacuum evaporation processing apparatus for treatment of metal surfaces of semiconductor components, and parts thereof; Vacuum evaporation apparatus for semiconductor manufacturing and parts thereof; Vacuum evaporation apparatus for plastic surface processing of semiconductor components, and parts thereof; Vacuum evaporation processing apparatus for use on glass surfaces of semiconductor components, and parts thereof; Cleaning machines comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean substrates such as semiconductor or glass substrates by blowing dust particles of the substrate surface, organic matter of the substrate surface or burrs which occur during micro-process on the substrate surface while scanning the carbon dioxide particles from the spray nozzle to the substrate; Cleaning machines comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean products such as electronic or semiconductor products by blowing dust particles of the product surface, organic matter of the product surface or burrs which occur during micro-process on the product surface while scanning the carbon dioxide particles from the spray nozzle to the product

Class [009]
Computer & Software Products & Electrical & Scientific Products


(Based on Sections 1(b) and 44(e)): Electronic components, namely, piezoelectric switches and digital transmitters; Integrated electronic circuits and parts thereof; Power line electrical communication systems for transferring broadband data over electrical power lines comprised of computer hardware, software and modems; Electronic machines for identifying surface thickness of thin film applications to semiconductor components and applying film applications to semiconductor components; Conductive material, namely, semiconductor wafers, light conducting filaments, insulated copper wire; Ionic solutions for providing conductivity for use in semiconductor manufacturing; Conductive material sprays incorporating ionic solutions for use in semiconductor manufacturing; Conductive paste incorporating ionic solutions for use in semiconductor manufacturing

Class [021]
Houseware and Glass Products


(Based on Sections 1(b) and 44(e)): Household containers for food; Dishware or dinnerware

Class [040]
Treatment & Processing of Materials Services


(Based on Sections 1(b) and 44(e)): Process coating of semiconductor components for others using thin film synthetic polymers (Based on Section 1(b) only): Processing and assembling of electronic components for the semiconductor manufacturing industry; Processing and assembly of electronic circuits and parts thereof for others; Processing and assembly of electrical communication components for the semiconductor manufacturing industry; Processing and assembly of electronic machines for use in the semiconductor manufacturing industry; Custom manufacture of machines for manufacturing electronic semiconductor components; Custom manufacture of semiconductor manufacturing machines and parts thereof; Custom manufacture of chemical processing machines and parts thereof; Custom manufacture of metalworking machines and parts thereof; Custom manufacture of plastic processing machines and parts thereof; Custom manufacture of industrial machines used to process physical properties of matter and energy, as well as chemical properties and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers on semiconductors, metal surfaces and electrical insulating materials; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for metal surface processing, and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for semiconductor manufacturing and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for plastic surface processing, and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for glass surface processing, and parts thereof; Custom manufacture of ion plating apparatus for metal surface processing and parts thereof; Custom manufacture of ion plating apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of ion plating apparatus for plastic surface processing and parts thereof; Custom manufacture of ion plating apparatus for glass surface processing and parts thereof; Custom manufacture of sputtering apparatus for metal surface processing and parts thereof; Custom manufacture of sputtering apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of sputtering apparatus for plastic surface processing and parts thereof; Custom manufacture of sputtering apparatus for glass surface processing and parts thereof; Custom manufacture of etching apparatus for metal surface processing and parts thereof; Custom manufacture of etching apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of etching apparatus for plastic surface processing and parts thereof; Custom manufacture of etching apparatus for glass surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for industrial surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for metal surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of vacuum evaporation apparatus for plastic surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for glass surface processing and parts thereof; Custom manufacture of cleaning apparatus comprising a spray nozzle connected to a liquid carbon dioxide tank, and replacement parts therefore

Class [042]
Computer & Software Services & Scientific Services


(Based on Sections 1(b) and 44(e): Advisory and consultancy services relating to the design of electronic components manufacturing machines for use in the semiconductor industry; Advisory and consultancy services relating to the design of semiconductor manufacturing machines and systems; Advisory and consultancy services relating to the design of chemical processing machines and apparatus; Advisory and consultancy services relating to the design of metalworking machines and apparatus; Advisory and consultancy services relating to the design of plastic processing machines and apparatus; Advisory and consultancy services relating to the design of industrial machines used to process physical properties of matter and energy, as well as chemical properties; Advisory and consultancy services relating to the design of machines for depositing thin film synthetic polymers on semiconductor components, metal surfaces and electrical insulating materials; Advisory and consultancy services relating to the design of machines for depositing thin film synthetic polymers by chemical vapor deposition for metal surface processing; Advisory and consultancy services relating to the design of machines for depositing thin film synthetic polymers by chemical vapor deposition for semiconductor manufacturing; Advisory and consultancy services relating to the design of machines for depositing thin film synthetic polymers by chemical vapor deposition for plastic surface processing; Advisory and consultancy services relating to the design of machines for depositing thin films by chemical vapor deposition for glass surface processing; Advisory and consultancy services relating to the design of ion plating apparatus for metal surface processing; Advisory and consultancy services relating to the design of ion plating apparatus for semiconductor manufacturing; Advisory and consultancy services relating to the design of ion plating apparatus for plastic surface processing; Advisory and consultancy services relating to the design of ion plating apparatus for glass surface processing; Advisory and consultancy services relating to the design of sputtering apparatus for metal surface processing; Advisory and consultancy services relating to the design of sputtering apparatus for semiconductor manufacturing; Advisory and consultancy services relating to the design of sputtering apparatus for plastic surface processing; Advisory and consultancy services relating to the design of sputtering apparatus for glass surface processing; Advisory and consultancy services relating to the design of etching apparatus for metal surface processing; Advisory and consultancy services relating to the design of etching apparatus for semiconductor manufacturing; Advisory and consultancy services relating to the design of etching apparatus for plastic surface processing; Advisory and consultancy services relating to the design of etching apparatus for glass surface processing; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for use in semiconductor processing; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for metal surface processing in the semiconductor industry; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for semiconductor manufacturing; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for plastic surface processing; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for glass surface processing; all of the above noted advisory and consultancy services provided to the order and/or specification of others

Class [045]
Personal & Legal & Social Services


(Based on Sections 1(b) and 44(e)): Licensing of intellectual property rights

Mark Details


Serial Number

No 87187723

Mark Type

No Service Mark

Attorney Docket Number

No TM16-5967

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

No

66A Current

No

Current Basis

No

No Basis

No

Design Code(s)

26.17.01 -

Straight line(s), band(s) or bar(s)

26.17.05 -

Horizontal line(s), band(s) or bar(s)

26.17.08 -

A single line, band, bar or diagonal

Legal History


Show more

Status DateAction Taken
14th Jan 2019ABANDONMENT - NO USE STATEMENT FILED
14th Jan 2019ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED
12th Jun 2018NOA E-MAILED - SOU REQUIRED FROM APPLICANT
17th Apr 2018OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
17th Apr 2018PUBLISHED FOR OPPOSITION
28th Mar 2018NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
13th Mar 2018ELECTRONIC RECORD REVIEW COMPLETE
09th Mar 2018ON HOLD - ELECTRONIC RECORD REVIEW REQUIRED
04th Mar 2018APPROVED FOR PUB - PRINCIPAL REGISTER
02th Mar 2018CORRESPONDENCE RECEIVED IN LAW OFFICE