YES

Class [007]
Machinery Products

Semiconductor manufacturing machines; Cleaning machines, namely, machines for removing impurities and descumming residues from silicon wafers; Stripping machines, namely, machines for stripping photoresist layers from silicon wafers; Plasma cleaning machines, namely, machines using plasma to remove impurities and descum residues from silicon wafers; Coating machines, namely, monolayer thin film coating machines for applying thin films to silicon wafers, micro-electro-mechanical systems, optical glass, and biomedical devices; Chemical vapor deposition machines for applying thin films to silicon wafers, micro-electro-mechanical systems, optical glass, and biomedical devices; Vacuum curing machines, namely, machines with vacuum chambers for curing and degassing semiconductor wafers; Annealing machines, namely, machines with vacuum chambers for altering physical and chemical properties of metal, for use in the manufacture of semiconductors; Bonding machines, namely, thin film coating machines for applying adhesive films between silicon wafers