on 25 Jul 2023
Last Applicant/ Owned by
Nakamura-ku
Nagoya-shi, Aichi
JP
450-0002
Serial Number
90084013 filed on 30th Jul 2020
Registration Number
7122258 registered on 25th Jul 2023
Correspondent Address
Sandra Epp Ryan
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
Plastic semi-worked products, namely, semi-worked synthetic plastic as semi-finished products in the form of pellets, rods, foils, foams, fibers, films and sheets; synthetic plastic as semi-finished products in the form of plates; metalized plastic sheets, including plastic sheets with metal foil, for use in the manufacture of electronic circuits, electrical circuits, antenna and filters; laminate Read More
Plastic semi-worked products, namely, semi-worked synthetic plastic as semi-finished products in the form of pellets, rods, foils, foams, fibers, films and sheets; synthetic plastic as semi-finished products in the form of plates; metalized plastic sheets, including plastic sheets with metal foil, for use in the manufacture of electronic circuits, electrical circuits, antenna and filters; laminate foil consisting primarily of plastic with or without a metal foil for application to a substrate; laminated boards of plastics for use in the manufacture of electronic circuits, electrical circuits, antenna and filters; semi-processed synthetic resins; semi-processed plastics; polymer films for use in the manufacture of electric/electronic circuits; electronic circuit and antenna material, namely, an insulated dielectric substrate material which is clad on one or both sides with a conductive layer for fabricating electronic circuits and antennas; electronic/electrical circuit board materials having a low dielectric dissipation factor, namely, an insulated dielectric substrate material which is clad on one or both sides with a conductive layer for fabricating electronic/electrical circuit boards; laminates in which one or both sides of low-dielectric constant electrical/electronic circuit materials are covered with a copper foil for fabricating electronic circuits; laminates in which one or both sides of low-dielectric dissipation factor electrical/electronic circuit materials are covered with a copper foil for fabricating electronic circuits
08th Jul 2022
22nd Mar 2023
No 90084013
No Service/Collective Mark
No 10873.2729US
No
No
No
No
No
No
No
No
Status Date | Action Taken |
---|---|
25th Jul 2023 | REGISTERE-PRINCIPAL REGISTER |
25th Jul 2023 | NOTICE O REGISTRATION CONIRMATION EMAILE |
23rd Jun 2023 | NOTICE O ACCEPTANCE O STATEMENT O USE E-MAILE |
22nd Jun 2023 | ALLOWE PRINCIPAL REGISTER - SOU ACCEPTE |
21st Jun 2023 | STATEMENT O USE PROCESSING COMPLETE |
13th Jun 2023 | TEAS STATEMENT O USE RECEIVE |
13th Jun 2023 | USE AMENMENT ILE |
01st Feb 2023 | TEAS CHANGE O OWNER ARESS RECEIVE |
01st Feb 2023 | TEAS REVOKE/APP/CHANGE AR O ATTY/OM REP RECEIVE |
01st Feb 2023 | ATTORNEY/OM.REP.REVOKE AN/OR APPOINTE |