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Dead/Cancelled
CANCELLED - SECTION 8
CANCELLED - SECTION 8
section 8
on 22 Sep 2007
Last Applicant/ Owned by
2-6, 1-Chome, Dojimahama, Kita-ku
Osaka
JP
Serial Number
75918604 filed on 15th Feb 2000
Registration Number
2414172 registered on 19th Dec 2000
in the Principal Register
Filing Basis
1. use application currently
Disclaimer
NO DATA
UNIPAD
Abrasive plastic foam pads for polishing the surface of wafers of semiconductor integrated circuits
Classification Information
Class [003]
Cosmetics and Cleaning Products
Abrasive plastic foam pads for polishing the surface of wafers of semiconductor integrated circuits
First Use Date in General
30th Oct 1999
First Use Date in Commerce
30th Oct 1999
Mark Details
Serial Number
No 75918604
Mark Type
No Service/Collective Mark
Attorney Docket Number
No 71-381T
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 22nd Sep 2007 | CANCELLED SEC. 8 (6-YR) |
| 20th Jul 2006 | CASE FILE IN TICRS |
| 19th Dec 2000 | REGISTERED-PRINCIPAL REGISTER |
| 26th Sep 2000 | PUBLISHED FOR OPPOSITION |
| 25th Aug 2000 | NOTICE OF PUBLICATION |
| 31st Jul 2000 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| 14th Jul 2000 | ASSIGNED TO EXAMINER |
| 12th Jul 2000 | ASSIGNED TO EXAMINER |