on 04 Feb 2024
Last Applicant/ Owned by
Chuo-ku
Osaka-shi, Osaka
JP
541-0045
Serial Number
79121905 filed on 11th Oct 2012
Registration Number
4348629 registered on 11th Jun 2013
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
Chemical additives for acid copper plating; chemicals for use in plating processes; chemical plating solutions; industrial chemicals
Chemical additives for acid copper plating; chemicals for use in plating processes; chemical plating solutions; industrial chemicals
No 79121905
No Service/Collective Mark
No 4T19715280
No
No
No
No
Yes
Yes
No
No
Status Date | Action Taken |
---|---|
04th Feb 2024 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
04th Feb 2024 | REGISTERED-SEC.71 ACCEPTED |
04th Feb 2024 | NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED |
31st May 2023 | TEAS SECTION 71 RECEIVED |
07th May 2023 | NEW REPRESENTATIVE AT IB RECEIVED |
27th Oct 2022 | INTERNATIONAL REGISTRATION RENEWED |
11th Jun 2022 | COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED |
16th May 2019 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
16th May 2019 | REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK. |
16th May 2019 | NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED |