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TECHXIV
Live/Registered
REGISTERED

on 16 Jan 2024

Last Applicant/ Owned by

Tokyo 105-8634

JP

Serial Number

79355754 filed on 25th Aug 2022

Registration Number

7273111 registered on 16th Jan 2024

in the Principal Register

Correspondent Address

Sean K. Owens

Sean K. Owens Wood Herron & Evans LLP

Suite 2800

Cincinnati, OH 45202

United States

Filing Basis

1. filing basis filed as 66 a

Disclaimer

NO DATA

TECHXIV

Silicon; pure non-metallic silicon sold in plates; pure non-metallic silicon sold in bars; polycrystal silicon; crystalline silicon in the form of single crystal silicon ingots; crystalline silicon in the form of single crystal silicon ingots for integrated circuits; nonferrous metals, namely, silicon Non ferrous metal and their alloys; ingots of common metal Semi-conductors; semi-conductor wafe Read More

Classification Information


Class [009]
Computer & Software Products & Electrical & Scientific Products


Semi-conductors; semi-conductor wafers; semi-conductor silicon wafers; crystal silicon wafers; optical glasses


First Use Date in General

N/A

First Use Date in Commerce

N/A

Class [006]
Metal Products


Non ferrous metal and their alloys; ingots of common metal


First Use Date in General

N/A

First Use Date in Commerce

N/A

Class [001]
Chemical Products


Silicon; pure non-metallic silicon sold in plates; pure non-metallic silicon sold in bars; polycrystal silicon; crystalline silicon in the form of single crystal silicon ingots; crystalline silicon in the form of single crystal silicon ingots for integrated circuits; nonferrous metals, namely, silicon


First Use Date in General

N/A

First Use Date in Commerce

N/A

Class [040]
Treatment & Processing of Materials Services


Material treatment, namely, crystallizing of silicon; slicing of semi-conductor silicon ingots; slicing of single crystal silicon ingots; slicing of metal ingots; cutting of semi-conductor wafers; cutting of semi-conductor; metal cutting; grinding of semi-conductor wafers; grinding of semi-conductor; grinding of metals; polishing of semi-conductor wafers; polishing of semi-conductor; polishing of metals; grinding; burnishing by abrasion; etching of semi conductor wafers; etching of semi-conductor; etching of metals; beveling of semi-conductor wafers; cleaning of semi-conductor wafers; cleaning of semi-conductor; surface treatment of semi conductor wafers by epitaxial growth; surface treatment of semi-conductor wafers by vapor deposition for forming thin films; material treatment, namely, impurity diffusion on semi-conductor wafers for forming diffusion layers; metalworking; metal treating; ceramic processing; glass processing; cutting of glass; grinding of glass


First Use Date in General

N/A

First Use Date in Commerce

N/A

Mark Details


Serial Number

No 79355754

Mark Type

No Service Mark

Attorney Docket Number

No SHG-687

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

Yes

66A Current

Yes

Current Basis

No

No Basis

No

Legal History


Show more

Status DateAction Taken
20th Aug 2024TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS
20th Aug 2024ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
20th Aug 2024TEAS CHANGE OF CORRESPONDENCE RECEIVED
20th Aug 2024TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
07th May 2024FINAL DECISION TRANSACTION PROCESSED BY IB
17th Apr 2024FINAL DISPOSITION NOTICE SENT TO IB
17th Apr 2024FINAL DISPOSITION PROCESSED
16th Apr 2024FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
22nd Jan 2024NOTICE OF REGISTRATION CONFIRMATION EMAILED
16th Jan 2024NOTICE OF REGISTRATION CONFIRMATION EMAILED