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Guest
Live/Registered
REGISTERED
REGISTERED
on 26 Feb 2019
Last Applicant/ Owned by
Higashi-ku, Hamamatsu-shi
Shizuoka
JP
435-8558
Serial Number
86598182 filed on 15th Apr 2015
Registration Number
5686410 registered on 26th Feb 2019
in the Principal Register
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
STEALTH DICING
Treatment of materials, namely, dicing semiconductor wafers; treatment of materials by laser beam
Classification Information
Class [040]
Treatment & Processing of Materials Services
Treatment of materials, namely, dicing semiconductor wafers; treatment of materials by laser beam
First Use Date in General
31st Aug 2016
First Use Date in Commerce
31st Aug 2016
Mark Details
Serial Number
No 86598182
Mark Type
No Service Mark
Attorney Docket Number
No FT15-0071-00
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 26th Feb 2024 | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED |
| 26th Feb 2019 | REGISTERED-PRINCIPAL REGISTER |
| 19th Jan 2019 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
| 18th Jan 2019 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
| 27th Dec 2018 | STATEMENT OF USE PROCESSING COMPLETE |
| 19th Dec 2018 | TEAS STATEMENT OF USE RECEIVED |
| 19th Dec 2018 | USE AMENDMENT FILED |
| 09th Jun 2018 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| 08th Jun 2018 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
| 08th Jun 2018 | SOU EXTENSION 5 GRANTED |