About 30,000 Trademarks found for “electrovert limited”

Electronic components in the nature of capacitors, resistors, fuses, filters, connectors, switches, transformers, semiconductors, integrated circuits, rectifiers, transistors, electric sensors, industrial automation controls and micro motion signals

[ Electrical Identification Markers for Wires, Cables and Tubes, Electrical Terminal Blocks, Terminal Strips, Electrical Connectors for the Mounting, Securing in Position, Interconnecting, Harnessing and Bundling of Wires, Cables and Tubes ]

Machines and Conveyorized Assembly Lines for the Forming, Shaping and Trimming of the Lead Wires and Terminals of Electronic Components and for the Assembly of Electrical and Electronic Components to Printed Wiring Boards and Other Supporting Substrates; Machines for the Automated Soldering of Printed and Integrated Circuit Assemblies and Other Electronic and Electrical Assemblies and Component Parts; Machines for the Automated Soldercoating and Tinning of Printed Wiring Boards and of the Lead Wires and Terminations of Electrical and Electronic Components; Machines for the Reflowing of Tin-Lead or Tin-Plated Printed Wiring Boards, Integrated Circuits and the Tin or Tin-Lead Plated Wires and Terminals of Electronic or Electrical Components; Machines for the Cleaning and Washing of Printed Wiring Boards, Printed Circuit Assemblies and Other Electrical and Electronic Components and Assemblies

Epoxy based surfacing film in the nature of coatings with an embedded conductive layer for protection from lightning strikes and electromagnetic interference; exterior surface protective coatings for lightning strike protection and electromagnetic interference; protective coatings for composite surfaces

ELECTRO VEST

The color(s) dark cyan and black is/are claimed as a feature of the mark.

In the statement, column 2, line 4, "France" should be deleted, and "Japan" should be inserted, and line 6, "France" should be deleted, and "Japan" should be inserted.

machines for manufacturing semiconductors, liquid crystal displays [, printed circuit boards, masks, reticles, floppy disks, magnetic tapes and keyboards ]

Air fryers

DECORATIVE ELECTRICAL CORDS AND CABLES

[ TEMPERATURE CONTROLLERS, TEMPERATURE CONTROLLERS WITH BIMETAL DISKS, TEMPERATURE CONTROLLERS WITH EXPANSION RODS, THERMAL CUT-OUTS WITH BIMETAL DISKS, THERMAL CUT-OUTS WITH EXPANSION RODS, ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; TEMPERATURE SENSORS, OXYGEN SENSORS, ELECTRONIC CONTROL AND EVALUATION UNITS FOR THE OPERATION AND SIGNAL EVALUATION OF OXYGEN SENSORS; OXYGEN MEASUREMENT APPARATUS, NAMELY, OXYGEN SENSORS; SENSORS FOR MONITORING LIQUID LEVEL, TEMPERATURE AND AIR FLOW; THERMAL SWITCHES, TEMPERATURE FUSES ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; ] COMPONENTS IN THE NATURE OF HOUSINGS FORMED OF COMPOSITE MATERIALS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; COMPONENTS FORMED WITH GLASS BUSHINGS IN THE NATURE OF HOUSINGS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; HYBRID HOUSINGS, NAMELY, HOUSINGS MADE OF METAL AND CERAMIC, FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR HOUSING TRANSISTORS, PASSIVE AND ACTIVE ELECTRONIC PARTS, OPTO-COUPLERS AND OPTO-ELECTRONIC PACKAGES; HIGH FREQUENCY HOUSINGS FOR OPTO-ELECTRONIC PACKAGES, AUTOMOTIVE ELECTRONICS AND ELECTRONIC FREQUENCY CONTROLS; HOUSINGS MADE OF METAL WITH GLASS BUSHINGS IN PARTICULAR FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE WITH COMPUTERS, NAMELY, FOR TRANSISTORS, SENSORS, PASSIVE AND ACTIVE ELECTRONIC PARTS; HOUSINGS MADE OF METAL FOR OPTOELECTRONIC COMPONENTS, NAMELY, LCD AND CMOS CHIPS, LASERS AND OPTO-COUPLERS; [ COOLERS WITH LIQUID COOLING AGENT FOR ELECTRONIC AND ELECTRICAL MODULE UNITS, ELECTRONIC AND ELECTRICAL COMPONENTS, ELECTRONIC AND ELECTRICAL APPARATUS AND THEIR PARTS, IN PARTICULAR MICRO CHANNEL COOLERS, HIGH PERFORMANCE COOLERS, COOLERS FOR PC (PERSONAL COMPUTER) HOUSINGS; COOLERS FOR LASER DIODES; CONTROL UNITS FOR CERAMIC SURFACE COOK TOPS FOR COOKING APPLIANCES; ]TRANSISTOR HEADERS, NAMELY, HOUSINGS FOR SEMICONDUCTOR CHIPS INCLUDING CONNECTING LEADS, FINS OR BALLS; COVERS FOR ELECTRIC BATTERIES IN PARTICULAR MADE OF STEEL OR SPECIAL STEEL; SENSOR HOUSINGS; IGNITER HEADERS, NAMELY, AIRBAG PYROLYTIC CHARGE IGNITER HEADERS [ ; THERMALLY CONDUCTING INTERFACE MATERIALS IN THE FORM OF THERMOCOUPLES FOR THE THERMAL COUPLING OF ELECTRICAL AND ELECTRONIC COMPONENTS; FIELD EMISSION CATHODES, HEAT SINKS AND HEAT STRADDLERS, NAMELY, HEAT SINKS FOR USE IN POWER ELECTRONIC MODULES, HEAT SINKS FOR USE IN MICROPROCESSORS, HEAT SINKS FOR USE IN POWER CHIPS SUCH AS LIGHT EMITTING DIODES OR LASERS, ALL FOR USE IN THE ELECTRONICS FIELD; CIRCUIT BOARDS, IN PARTICULAR CERAMIC CIRCUIT BOARDS; SEMICONDUCTOR CHIP HOUSINGS MADE OF COPPER COATED CERAMIC, IN PARTICULAR MADE OF COPPER COATED ALUMINUM OXIDE CERAMIC OR ALUMINUM NITRIDE CERAMIC FOR USE IN THE ELECTRONICS FIELD; COPPER COATED ALUMINUM OXIDE SUBSTRATES FOR INTEGRATED CIRCUITS; COPPER COATED ALUMINUM NITRIDE SUBSTRATES FOR INTEGRATED CIRCUITS; THERMALLY CONDUCTING FOILS AND PADS FOR USE AS HEAT SINKS IN ELECTRONIC COMPONENTS IN THE NATURE OF INTEGRATED CIRCUITS ]

[ TEMPERATURE CONTROLLERS, TEMPERATURE CONTROLLERS WITH BIMETAL DISKS, TEMPERATURE CONTROLLERS WITH EXPANSION RODS, THERMAL CUT-OUTS WITH BIMETAL DISKS, THERMAL CUT-OUTS WITH EXPANSION RODS, ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; TEMPERATURE SENSORS, OXYGEN SENSORS, ELECTRONIC CONTROL AND EVALUATION UNITS FOR THE OPERATION AND SIGNAL EVALUATION OF OXYGEN SENSORS; OXYGEN MEASUREMENT APPARATUS, NAMELY, OXYGEN SENSORS; SENSORS FOR MONITORING LIQUID LEVEL, TEMPERATURE AND AIR FLOW; THERMAL SWITCHES, TEMPERATURE FUSES ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; ] COMPONENTS IN THE NATURE OF HOUSINGS FORMED OF COMPOSITE MATERIALS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; COMPONENTS FORMED WITH GLASS BUSHINGS IN THE NATURE OF HOUSINGS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; HYBRID HOUSINGS, NAMELY, HOUSINGS MADE OF METAL AND CERAMIC, FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR HOUSING TRANSISTORS, PASSIVE AND ACTIVE ELECTRONIC PARTS, OPTO-COUPLERS AND OPTO-ELECTRONIC PACKAGES; HIGH FREQUENCY HOUSINGS FOR OPTO-ELECTRONIC PACKAGES, AUTOMOTIVE ELECTRONICS AND ELECTRONIC FREQUENCY CONTROLS; HOUSINGS MADE OF METAL WITH GLASS BUSHINGS IN PARTICULAR FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE WITH COMPUTERS, NAMELY, FOR TRANSISTORS, SENSORS, PASSIVE AND ACTIVE ELECTRONIC PARTS; HOUSINGS MADE OF METAL FOR OPTOELECTRONIC COMPONENTS, NAMELY, LCD AND CMOS CHIPS, LASERS AND OPTO-COUPLERS; [ COOLERS WITH LIQUID COOLING AGENT FOR ELECTRONIC AND ELECTRICAL MODULE UNITS, ELECTRONIC AND ELECTRICAL COMPONENTS, ELECTRONIC AND ELECTRICAL APPARATUS AND THEIR PARTS, IN PARTICULAR MICRO CHANNEL COOLERS, HIGH PERFORMANCE COOLERS, COOLERS FOR PC (PERSONAL COMPUTER) HOUSINGS; COOLERS FOR LASER DIODES; CONTROL UNITS FOR CERAMIC SURFACE COOK TOPS FOR COOKING APPLIANCES; ]TRANSISTOR HEADERS, NAMELY, HOUSINGS FOR SEMICONDUCTOR CHIPS INCLUDING CONNECTING LEADS, FINS OR BALLS; COVERS FOR ELECTRIC BATTERIES IN PARTICULAR MADE OF STEEL OR SPECIAL STEEL; SENSOR HOUSINGS; IGNITER HEADERS, NAMELY, AIRBAG PYROLYTIC CHARGE IGNITER HEADERS [ ; THERMALLY CONDUCTING INTERFACE MATERIALS IN THE FORM OF THERMOCOUPLES FOR THE THERMAL COUPLING OF ELECTRICAL AND ELECTRONIC COMPONENTS; FIELD EMISSION CATHODES, HEAT SINKS AND HEAT STRADDLERS, NAMELY, HEAT SINKS FOR USE IN POWER ELECTRONIC MODULES, HEAT SINKS FOR USE IN MICROPROCESSORS, HEAT SINKS FOR USE IN POWER CHIPS SUCH AS LIGHT EMITTING DIODES OR LASERS, ALL FOR USE IN THE ELECTRONICS FIELD; CIRCUIT BOARDS, IN PARTICULAR CERAMIC CIRCUIT BOARDS; SEMICONDUCTOR CHIP HOUSINGS MADE OF COPPER COATED CERAMIC, IN PARTICULAR MADE OF COPPER COATED ALUMINUM OXIDE CERAMIC OR ALUMINUM NITRIDE CERAMIC FOR USE IN THE ELECTRONICS FIELD; COPPER COATED ALUMINUM OXIDE SUBSTRATES FOR INTEGRATED CIRCUITS; COPPER COATED ALUMINUM NITRIDE SUBSTRATES FOR INTEGRATED CIRCUITS; THERMALLY CONDUCTING FOILS AND PADS FOR USE AS HEAT SINKS IN ELECTRONIC COMPONENTS IN THE NATURE OF INTEGRATED CIRCUITS ]

Apparatus and installations for air humidification, namely, humidifiers; Apparatus and installations for hot-air baths, namely, steam generators for saunas; Steam generating apparatus and installations

[ TEMPERATURE CONTROLLERS, TEMPERATURE CONTROLLERS WITH BIMETAL DISKS, TEMPERATURE CONTROLLERS WITH EXPANSION RODS, THERMAL CUT-OUTS WITH BIMETAL DISKS, THERMAL CUT-OUTS WITH EXPANSION RODS, ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; TEMPERATURE SENSORS, OXYGEN SENSORS, ELECTRONIC CONTROL AND EVALUATION UNITS FOR THE OPERATION AND SIGNAL EVALUATION OF OXYGEN SENSORS; OXYGEN MEASUREMENT APPARATUS, NAMELY, OXYGEN SENSORS; SENSORS FOR MONITORING LIQUID LEVEL, TEMPERATURE AND AIR FLOW; THERMAL SWITCHES, TEMPERATURE FUSES ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; ] COMPONENTS IN THE NATURE OF HOUSINGS FORMED OF COMPOSITE MATERIALS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; COMPONENTS FORMED WITH GLASS BUSHINGS IN THE NATURE OF HOUSINGS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; HYBRID HOUSINGS, NAMELY, HOUSINGS MADE OF METAL AND CERAMIC, FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR HOUSING TRANSISTORS, PASSIVE AND ACTIVE ELECTRONIC PARTS, OPTO-COUPLERS AND OPTO-ELECTRONIC PACKAGES; HIGH FREQUENCY HOUSINGS FOR OPTO-ELECTRONIC PACKAGES, AUTOMOTIVE ELECTRONICS AND ELECTRONIC FREQUENCY CONTROLS; HOUSINGS MADE OF METAL WITH GLASS BUSHINGS IN PARTICULAR FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE WITH COMPUTERS, NAMELY, FOR TRANSISTORS, SENSORS, PASSIVE AND ACTIVE ELECTRONIC PARTS; HOUSINGS MADE OF METAL FOR OPTOELECTRONIC COMPONENTS, NAMELY, LCD AND CMOS CHIPS, LASERS AND OPTO-COUPLERS; [ COOLERS WITH LIQUID COOLING AGENT FOR ELECTRONIC AND ELECTRICAL MODULE UNITS, ELECTRONIC AND ELECTRICAL COMPONENTS, ELECTRONIC AND ELECTRICAL APPARATUS AND THEIR PARTS, IN PARTICULAR MICRO CHANNEL COOLERS, HIGH PERFORMANCE COOLERS, COOLERS FOR PC (PERSONAL COMPUTER) HOUSINGS; COOLERS FOR LASER DIODES; CONTROL UNITS FOR CERAMIC SURFACE COOK TOPS FOR COOKING APPLIANCES; ] TRANSISTOR HEADERS, NAMELY, HOUSINGS FOR SEMICONDUCTOR CHIPS INCLUDING CONNECTING LEADS, FINS OR BALLS; COVERS FOR ELECTRIC BATTERIES IN PARTICULAR MADE OF STEEL OR SPECIAL STEEL; SENSOR HOUSINGS; IGNITER HEADERS, NAMELY, AIRBAG PYROLYTIC CHARGE IGNITER HEADERS [; THERMALLY CONDUCTING INTERFACE MATERIALS IN THE FORM OF THERMOCOUPLES FOR THE THERMAL COUPLING OF ELECTRICAL AND ELECTRONIC COMPONENTS; FIELD EMISSION CATHODES, HEAT SINKS AND HEAT STRADDLERS, NAMELY, HEAT SINKS FOR USE IN POWER ELECTRONIC MODULES, HEAT SINKS FOR USE IN MICROPROCESSORS, HEAT SINKS FOR USE IN POWER CHIPS SUCH AS LIGHT EMITTING DIODES OR LASERS, ALL FOR USE IN THE ELECTRONICS FIELD; CIRCUIT BOARDS, IN PARTICULAR CERAMIC CIRCUIT BOARDS; SEMICONDUCTOR CHIP HOUSINGS MADE OF COPPER COATED CERAMIC, IN PARTICULAR MADE OF COPPER COATED ALUMINUM OXIDE CERAMIC OR ALUMINUM NITRIDE CERAMIC FOR USE IN THE ELECTRONICS FIELD; COPPER COATED ALUMINUM OXIDE SUBSTRATES FOR INTEGRATED CIRCUITS; COPPER COATED ALUMINUM NITRIDE SUBSTRATES FOR INTEGRATED CIRCUITS; THERMALLY CONDUCTING FOILS AND PADS FOR USE AS HEAT SINKS IN ELECTRONIC COMPONENTS IN THE NATURE OF INTEGRATED CIRCUITS ]

ELECTRO VACUUM