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ELECTROVAC
Live/Registered
REGISTERED AND RENEWED

on 25 Oct 2020

Last Applicant/ Owned by

COMERCIALSTRASSE 19

CHUR

CH

7000

Serial Number

78811143 filed on 09th Feb 2006

Registration Number

3839382 registered on 24th Aug 2010

in the Principal Register

Correspondent Address

Ursula B. Day

Ursula B. Day

35West 35th Street

Suite 900

NEW YORK, NY, , 10001

Filing Basis

1. intent to use

2. use application currently

Disclaimer

NO DATA

ELECTROVAC

[ TEMPERATURE CONTROLLERS, TEMPERATURE CONTROLLERS WITH BIMETAL DISKS, TEMPERATURE CONTROLLERS WITH EXPANSION RODS, THERMAL CUT-OUTS WITH BIMETAL DISKS, THERMAL CUT-OUTS WITH EXPANSION RODS, ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; TEMPERATURE SENSORS, OXYGEN SENSORS, ELECTRONIC CONTROL AND EVALUATION UNITS FOR THE OPERATION AND SIGNAL EVALUAT Read More

Classification Information


Class [001]
Chemical Products


[ PLASTICS ADDITIVES, IN PARTICULAR POLYMER BONDED NANOFIBER MASTER BATCHES AND COMPOUNDS FOR REINFORCEMENT IN COMPOSITE MATERIALS FOR MECHANICAL, ELECTRICAL AND THERMAL USE; THERMALLY CONDUCTING ADHESIVES ALSO IN THE FORM OF PASTES; THE FOREGOING ALL FOR USE IN MANUFACTURING IN THE AUTOMOTIVE, AEROSPACE, MEDICAL, AND ELECTRONICS INDUSTRY, FOR USE IN ENVIRONMENTAL TECHNOLOGY AND FOR USE IN MAJOR APPLIANCES ]


First Use Date in General

30th Nov 2005

First Use Date in Commerce

30th Nov 2005

Class [009]
Computer & Software Products & Electrical & Scientific Products


[ TEMPERATURE CONTROLLERS, TEMPERATURE CONTROLLERS WITH BIMETAL DISKS, TEMPERATURE CONTROLLERS WITH EXPANSION RODS, THERMAL CUT-OUTS WITH BIMETAL DISKS, THERMAL CUT-OUTS WITH EXPANSION RODS, ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; TEMPERATURE SENSORS, OXYGEN SENSORS, ELECTRONIC CONTROL AND EVALUATION UNITS FOR THE OPERATION AND SIGNAL EVALUATION OF OXYGEN SENSORS; OXYGEN MEASUREMENT APPARATUS, NAMELY, OXYGEN SENSORS; SENSORS FOR MONITORING LIQUID LEVEL, TEMPERATURE AND AIR FLOW; THERMAL SWITCHES, TEMPERATURE FUSES ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; ] COMPONENTS IN THE NATURE OF HOUSINGS FORMED OF COMPOSITE MATERIALS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; COMPONENTS FORMED WITH GLASS BUSHINGS IN THE NATURE OF HOUSINGS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; HYBRID HOUSINGS, NAMELY, HOUSINGS MADE OF METAL AND CERAMIC, FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR HOUSING TRANSISTORS, PASSIVE AND ACTIVE ELECTRONIC PARTS, OPTO-COUPLERS AND OPTO-ELECTRONIC PACKAGES; HIGH FREQUENCY HOUSINGS FOR OPTO-ELECTRONIC PACKAGES, AUTOMOTIVE ELECTRONICS AND ELECTRONIC FREQUENCY CONTROLS; HOUSINGS MADE OF METAL WITH GLASS BUSHINGS IN PARTICULAR FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE WITH COMPUTERS, NAMELY, FOR TRANSISTORS, SENSORS, PASSIVE AND ACTIVE ELECTRONIC PARTS; HOUSINGS MADE OF METAL FOR OPTOELECTRONIC COMPONENTS, NAMELY, LCD AND CMOS CHIPS, LASERS AND OPTO-COUPLERS; [ COOLERS WITH LIQUID COOLING AGENT FOR ELECTRONIC AND ELECTRICAL MODULE UNITS, ELECTRONIC AND ELECTRICAL COMPONENTS, ELECTRONIC AND ELECTRICAL APPARATUS AND THEIR PARTS, IN PARTICULAR MICRO CHANNEL COOLERS, HIGH PERFORMANCE COOLERS, COOLERS FOR PC (PERSONAL COMPUTER) HOUSINGS; COOLERS FOR LASER DIODES; CONTROL UNITS FOR CERAMIC SURFACE COOK TOPS FOR COOKING APPLIANCES; ] TRANSISTOR HEADERS, NAMELY, HOUSINGS FOR SEMICONDUCTOR CHIPS INCLUDING CONNECTING LEADS, FINS OR BALLS; COVERS FOR ELECTRIC BATTERIES IN PARTICULAR MADE OF STEEL OR SPECIAL STEEL; SENSOR HOUSINGS; IGNITER HEADERS, NAMELY, AIRBAG PYROLYTIC CHARGE IGNITER HEADERS [; THERMALLY CONDUCTING INTERFACE MATERIALS IN THE FORM OF THERMOCOUPLES FOR THE THERMAL COUPLING OF ELECTRICAL AND ELECTRONIC COMPONENTS; FIELD EMISSION CATHODES, HEAT SINKS AND HEAT STRADDLERS, NAMELY, HEAT SINKS FOR USE IN POWER ELECTRONIC MODULES, HEAT SINKS FOR USE IN MICROPROCESSORS, HEAT SINKS FOR USE IN POWER CHIPS SUCH AS LIGHT EMITTING DIODES OR LASERS, ALL FOR USE IN THE ELECTRONICS FIELD; CIRCUIT BOARDS, IN PARTICULAR CERAMIC CIRCUIT BOARDS; SEMICONDUCTOR CHIP HOUSINGS MADE OF COPPER COATED CERAMIC, IN PARTICULAR MADE OF COPPER COATED ALUMINUM OXIDE CERAMIC OR ALUMINUM NITRIDE CERAMIC FOR USE IN THE ELECTRONICS FIELD; COPPER COATED ALUMINUM OXIDE SUBSTRATES FOR INTEGRATED CIRCUITS; COPPER COATED ALUMINUM NITRIDE SUBSTRATES FOR INTEGRATED CIRCUITS; THERMALLY CONDUCTING FOILS AND PADS FOR USE AS HEAT SINKS IN ELECTRONIC COMPONENTS IN THE NATURE OF INTEGRATED CIRCUITS ]


First Use Date in General

30th Nov 2005

First Use Date in Commerce

30th Nov 2005

Class [017]
Rubber Products


ELECTRICAL INSULATORS, NAMELY, GLASS BUSHINGS, IN PARTICULAR PRE-STRESSED GLASS BUSHINGS AND TUNED GLASS BUSHINGS FOR USE IN INTEGRATED CIRCUITS [: CARBON NANOFIBERS NOT FOR TEXTILE USE; GRAPHITIC NANOFIBERS NOT FOR TEXTILE USE; THERMALLY CONDUCTING ADHESIVE TAPES FOR INDUSTRIAL AND COMMERCIAL USE ]


First Use Date in General

30th Nov 2005

First Use Date in Commerce

30th Nov 2005

Mark Details


Serial Number

No 78811143

Mark Type

No Service/Collective Mark

Attorney Docket Number

No TM/ELECTROVA

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

No

66A Current

No

Current Basis

No

No Basis

No

Legal History


Show more

Status DateAction Taken
25th Oct 2020REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
25th Oct 2020NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
25th Oct 2020REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
15th Sep 2020CASE ASSIGNED TO POST REGISTRATION PARALEGAL
05th Aug 2020TEAS SECTION 8 & 9 RECEIVED
24th Aug 2019COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
26th Oct 2016NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
26th Oct 2016REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
26th Oct 2016CASE ASSIGNED TO POST REGISTRATION PARALEGAL
23rd Aug 2016TEAS SECTION 8 & 15 RECEIVED