About 30,000 Trademarks found for “adtec advertising inc”

Advertising agency services; and advertising services, namely, advertising the [ goods, services and ] legal notices of others by receiving advertising copy from advertisers, modifying advertising copy, and transmitting copy to electronic and print publications

AD TECH

Color is not claimed as a feature of the mark.

THE DRAWING IS AMENDED TO APPEAR AS FOLLOWS: ADTECH

AD TECH

CERAMIC AND METAL ELECTRONIC COMPONENTS, NAMELY, SINGLE AND MULTI-LAYER CO-FIRE CERAMIC PACKAGES, CERAMIC PACKAGES, CERAMIC PACKAGING, MULTI LAYER CERAMICS AND BRAZED ASSEMBLIES THEREFOR ALL FOR MICRO ELECTRONIC HIGH RELIABILITY APPLICATIONS FOR USE IN COMBINATION WITH MICROCHIPS, RESISTORS AND CAPACITORS; CERAMIC CHIP SCALE PACKAGING, NAMELY, INTEGRATED CIRCUIT PACKAGES THAT CONTACT PADS INSTEAD OF PINS OR WIRES; CERAMIC PIN GRID ARRAYS AND CERAMIC BALL GRID ARRAYS ALL IN THE NATURE OF CONFIGURATIONS FOR MICROPROCESSOR SOCKETS ON COMPUTER MOTHERBOARDS; MULTI CHIP INTEGRATED CIRCUIT MODULES; FEEDTHROUGHS, NAMELY, CERAMIC CO-FIRED CONDUCTORS HERMETICALLY CONNECTING TWO CIRCUITS ON OPPOSITE SIDES OF A METAL HOUSING; HEAT SPREADERS FOR REMOVING HEAT FROM HIGH POWER DEVICES IN A CERAMIC PACKAGE; LEADLESS CERAMIC CHIP CARRIERS, NAMELY, SEMICONDUCTOR CHIP HOUSINGS; BRAZED METAL ELECTRONIC ASSEMBLIES, NAMELY, QUAD FLAT PACKS AND DUAL IN-LINE PACKAGES FOR USE WITH INTEGRATED CIRCUITS

"CERAMICS"

Ceramic and metal electronic components, namely, single and multi-layer co-fire ceramic packages, ceramic packages, ceramic packaging, multi layer ceramics and brazed assemblies therefor all for micro electronic high reliability applications for use in combination with microchips, resistors and capacitors; ceramic chip scale packaging, namely, integrated circuit packages that contact pads instead of pins or wires; ceramic pin grid arrays and ceramic ball grid arrays all in the nature of configurations for microprocessor sockets on computer motherboards; multi chip integrated circuit modules; feedthroughs, namely, ceramic co-fired conductors hermetically connecting two circuits on opposite sides of a metal housing; heat spreaders for removing heat from high power devices in a ceramic package; leadless ceramic chip carriers, namely, semiconductor chip housings; brazed metal electronic assemblies, namely, quad flat packs and dual in-line packages for use with integrated circuits

ADVANCED TECHNICAL CERAMICS

hot melt glue guns

Color is not claimed as a feature of the mark.

Downloadable augmented reality software applications for measuring child's height, recording growth of child and managing growth record of child

Software as a service (SaaS) services featuring augmented reality software for measuring child's height, recording growth of child and managing growth record of child

NOISE ABSORBER AND BARRIER MATERIALS, STRUCTURES AND DEVICES