REGISTERED AND RENEWED
on 28 Sep 2016
Last Applicant/ Owned by
511 Manufacturers Road
Chattanooga
TN
37405
Serial Number
78538024 filed on 23rd Dec 2004
Registration Number
3248940 registered on 05th Jun 2007
Correspondent Address
Jeffrey L. Van Hoosear
Filing Basis
1. use application currently
Disclaimer
NO DATA
ADTECH CERAMICS
CERAMIC AND METAL ELECTRONIC COMPONENTS, NAMELY, SINGLE AND MULTI-LAYER CO-FIRE CERAMIC PACKAGES, CERAMIC PACKAGES, CERAMIC PACKAGING, MULTI LAYER CERAMICS AND BRAZED ASSEMBLIES THEREFOR ALL FOR MICRO ELECTRONIC HIGH RELIABILITY APPLICATIONS FOR USE IN COMBINATION WITH MICROCHIPS, RESISTORS AND CAPACITORS; CERAMIC CHIP SCALE PACKAGING, NAMELY, INTEGRATED CIRCUIT PACKAGES THAT CONTACT PADS INSTEAD Read More
Classification Information
Class [009]
Computer & Software Products & Electrical & Scientific Products
CERAMIC AND METAL ELECTRONIC COMPONENTS, NAMELY, SINGLE AND MULTI-LAYER CO-FIRE CERAMIC PACKAGES, CERAMIC PACKAGES, CERAMIC PACKAGING, MULTI LAYER CERAMICS AND BRAZED ASSEMBLIES THEREFOR ALL FOR MICRO ELECTRONIC HIGH RELIABILITY APPLICATIONS FOR USE IN COMBINATION WITH MICROCHIPS, RESISTORS AND CAPACITORS; CERAMIC CHIP SCALE PACKAGING, NAMELY, INTEGRATED CIRCUIT PACKAGES THAT CONTACT PADS INSTEAD OF PINS OR WIRES; CERAMIC PIN GRID ARRAYS AND CERAMIC BALL GRID ARRAYS ALL IN THE NATURE OF CONFIGURATIONS FOR MICROPROCESSOR SOCKETS ON COMPUTER MOTHERBOARDS; MULTI CHIP INTEGRATED CIRCUIT MODULES; FEEDTHROUGHS, NAMELY, CERAMIC CO-FIRED CONDUCTORS HERMETICALLY CONNECTING TWO CIRCUITS ON OPPOSITE SIDES OF A METAL HOUSING; HEAT SPREADERS FOR REMOVING HEAT FROM HIGH POWER DEVICES IN A CERAMIC PACKAGE; LEADLESS CERAMIC CHIP CARRIERS, NAMELY, SEMICONDUCTOR CHIP HOUSINGS; BRAZED METAL ELECTRONIC ASSEMBLIES, NAMELY, QUAD FLAT PACKS AND DUAL IN-LINE PACKAGES FOR USE WITH INTEGRATED CIRCUITS
First Use Date in General
26th Mar 2004
First Use Date in Commerce
02th Apr 2004
Class [001]
Chemical Products
CERAMIC COMPOSITIONS IN THE SOLID STATE FOR MANUFACTURE OF ALUMINA HIGH TEMPERATURE COFIRED CERAMIC (HTCC) AND LOW TEMPERATURE CO-FIRE CERAMIC (LTCC); ALUMINUM NITRIDE (AIN) FOR USE IN THE MANUFACTURE OF CERAMIC ELECTRONIC COMPONENTS; CERAMIC COMPOSITIONS IN THE SOLID STATE FOR MANUFACTURE OF CERAMIC ELECTRONIC COMPONENTS, NAMELY, NON-METAL CERAMIC SUBSTRATES
First Use Date in General
26th Mar 2004
First Use Date in Commerce
02th Apr 2004
Mark Details
Serial Number
No 78538024
Mark Type
No Service/Collective Mark
Attorney Docket Number
No ATCC.004T
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Design Code(s)
26.07.13 -
Two diamonds
26.17.13 -
Letters or words underlined and/or overlined by one or more strokes or lines
Legal History
| Status Date | Action Taken |
|---|---|
| 28th Sep 2016 | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED |
| 28th Sep 2016 | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) |
| 28th Sep 2016 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
| 28th Sep 2016 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| 11th Jul 2016 | TEAS SECTION 8 & 9 RECEIVED |
| 05th Jun 2016 | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED |
| 09th Jul 2012 | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED |
| 08th Jul 2012 | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. |
| 08th Jul 2012 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| 29th Jun 2012 | TEAS SECTION 8 & 15 RECEIVED |