About 149 Trademarks found for “*soi”

Integrated circuits

The mark consists of the letters "r", "a", and "s" in red and lower case. Then the letter "o" is depicted in a red tomato with a green stem. The last letter is depicted by a green chilli pepper with a green stem.

Providing temporary use of on-line non-downloadable software for hospitality risk management

Education services, namely, providing courses and non-downloadable webinars, podcasts and video podcasts all in the field of business to employees and executives and distribution of training materials in connection therewith; providing continuing business education courses; non-downloadable electronic publications in the nature of white papers, guides, articles, case studies and newsletters in the field of human resources management, professional employer organization (PEO) services, business education and corporate training; on-line journals, namely, blogs featuring topics in the field of human resources management, professional employer organization (PEO) services, business education and corporate training; none of the foregoing services related to pharmacy benefits or provided to pharmacies or personnel thereof

Downloadable software for monitoring, analyzing, searching, tracking, managing and reporting of expenses, payroll, time, travel, employee performance, potential employer-related liabilities, human resources claims and employment practices liability insurance claims, and other business data; downloadable computer software for use in human resources management and professional employer organization (PEO) services management, such as for managing employee payroll, benefits and regulatory compliance; downloadable electronic publications in the nature of white papers, guides, articles, case studies and newsletters in the field of human resources management, professional employer organization (PEO) services, business education and corporate training; none of the foregoing related to pharmacy benefits or provided to pharmacies or personnel thereof

computer software featuring instructional material about intellectual testing, including the testing of reading and other intellectual functions

The mark consists of An international globe view with bodies of water shown in purple and continents shown in white. The globe is outlined in pink. In the middle of the globe are the initials S, O and I. The S and O are pink and outlined in purple. Just below those initials are the words SPEAK OUT in purple and underlined in pink then under the line is the word INTERNATIONAL also in purple. In the middle of the O is the letter I. The letter I is filled with butterflies in the color purple with small spaces of white. The art resembles a vine. To the middle and lower right hand corner of the of the I are butterflies with those at the top and bottom in pink and those in the middle purple.

Silicon wafers; silicon wafers having insulating layers; integrated circuits for computers; integrated circuits for cellular phones; integrated circuits for digital consumer devices, namely, digital cameras, digital audio players, digital video cameras, television sets, digital video disk recorders, digital video disk players, ink jet printers, scanners, liquid crystal display projectors, personal digital assistants (PDAs) and personal computers

Freshly made food for delivery, pickup and catering

Services for the treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits, namely, modification of mechanical, physical, chemical, electrical properties of semiconductor materials substrates and silicon wafers by thermal treatment, ion implantation, chemical treatment, chemical-mechanical-polishing treatment and all treatment used in the semiconductor industry; transfer of microelectronics circuits, namely, integrated circuits, or of micro-systems, namely, pressure sensors, accelerometer, gyrometer, optical sensors, bio-sensors, magnetic sensors and actuators, onto different types of support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, piezoelectric support materials; mechanical, chemical and physical treatment and machining of surfaces of wafers; stacking of integrated circuits, namely custom fabrication of semi-conductors for others; treatment of wafers for micro-electronics and any derived activities, namely, nano-electronics, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; fabrication of micro-systems as described by technologies coming from microelectronics, namely, prototype fabrication of new products for others in the field of microelectronics; treatment of silicon circuit boards and semiconductors, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; polishing of silicon circuit wafers and semiconductors, namely, modification of roughness of surface by chemical-mechanical-polishing treatment; transfer of silicon layers, semiconductors or components onto other support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, ceramics, piezoelectric support materials

Services for the treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits, namely, modification of mechanical, physical, chemical, electrical properties of semiconductor materials substrates and silicon wafers by thermal treatment, ion implantation, chemical treatment, chemical-mechanical-polishing treatment and all treatment used in the semiconductor industry; transfer of microelectronics circuits, namely, integrated circuits, or of micro-systems, namely, pressure sensors, accelerometer, gyrometer, optical sensors, bio-sensors, magnetic sensors and actuators, onto different types of support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, piezoelectric support materials; mechanical, chemical and physical treatment and machining of surfaces of wafers; stacking of integrated circuits, namely custom fabrication of semi-conductors for others; treatment of wafers for micro-electronics and any derived activities, namely, nano-electronics, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; fabrication of micro-systems as described by technologies coming from microelectronics, namely, prototype fabrication of new products for others in the field of microelectronics; treatment of silicon circuit boards and semiconductors, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; polishing of silicon circuit wafers and semiconductors, namely, modification of roughness of surface by chemical-mechanical-polishing treatment; transfer of silicon layers, semiconductors or components onto other support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, ceramics, piezoelectric support materials