CANCELLED - SECTION 8
section 8
on 08 Nov 2013
Last Applicant/ Owned by
CHEMIN DES FRANQUES
BERNIN
FR
38190
Serial Number
78316644 filed on 21st Oct 2003
Registration Number
3223751 registered on 03rd Apr 2007
Filing Basis
1. intent to use
Disclaimer
NO DATA
D-BSOI
Services for the treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits, namely, modification of mechanical, physical, chemical, electrical properties of semiconductor materials substrates and silicon wafers by thermal treatment, ion implantation, chemical treatment, chemical-mechanical-polishing treatment and all treatment used in the semicon Read More
Classification Information
Class [001]
Chemical Products
Silicon and semiconductor substrates for use in the field of microelectronics and micro-mechanics, namely, substrates composed of silicon, gallium arsenide, silicon carbide, indium phosphide, germanium and silica, for use in the manufacture of integrated circuits
Class [009]
Computer & Software Products & Electrical & Scientific Products
Magnetic components, namely magnetic head, magnetic random access memory; optical devices, namely optical switch, optical multiplexer; silicon circuit boards; semiconductors; silicon circuit boards and semiconductors for printed circuits and integrated circuits; micro-electronics circuits and micro-mechanics components, namely pressure sensors, accelerometer, gyrometer, optical sensors, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA; semiconductor wafers for micro-electronics and micro-mechanics, namely, for flat screens, for integrated optical guides, for sensors, for smart cards or microprocessor cards, for magnetic identification cards; micro-electronic circuits, micro-systems, namely, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA, pressure sensors, accelerometers, gyrometers
Class [021]
Houseware and Glass Products
Semiconductor substrates for use in the field of microelectronics and micro-mechanics, namely, substrates composed of ceramic and piezoelectric materials, for use in the manufacture of integrated circuits
Class [038]
Communications Services
Communication and services of electronic mail by computer, telephone, satellite network or radio relay system; services of transmission of information, messages, images, sounds, video, software or data notably by computer, telephone, satellite network or radio relay system
Class [040]
Treatment & Processing of Materials Services
Services for the treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits, namely, modification of mechanical, physical, chemical, electrical properties of semiconductor materials substrates and silicon wafers by thermal treatment, ion implantation, chemical treatment, chemical-mechanical-polishing treatment and all treatment used in the semiconductor industry; transfer of microelectronics circuits, namely, integrated circuits, or of micro-systems, namely, pressure sensors, accelerometer, gyrometer, optical sensors, bio-sensors, magnetic sensors and actuators, onto different types of support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, piezoelectric support materials; mechanical, chemical and physical treatment and machining of surfaces of wafers; stacking of integrated circuits, namely custom fabrication of semi-conductors for others; treatment of wafers for micro-electronics and any derived activities, namely, nano-electronics, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; fabrication of micro-systems as described by technologies coming from microelectronics, namely, prototype fabrication of new products for others in the field of microelectronics; treatment of silicon circuit boards and semiconductors, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; polishing of silicon circuit wafers and semiconductors, namely, modification of roughness of surface by chemical-mechanical-polishing treatment; transfer of silicon layers, semiconductors or components onto other support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, ceramics, piezoelectric support materials
Class [042]
Computer & Software Services & Scientific Services
Scientific, technological, technical and industrial research; material testing; laboratory research for others in the field of silicon circuit boards and semiconductors for integrated circuits and the transfer of microelectronic circuits or micro-systems onto all types of media; research and development of new products for third parties; research and development of new products particularly in the field of silicon circuit boards and semiconductors for integrated circuits and in the field of nano-electronics or fabrication or micro-systems by technologies coming from microelectronics; research and development of new products particularly in the field of transferring microelectronic circuits onto all types of media; engineering and technical consultation, particularly in the field of silicon circuit boards and semiconductors for integrated circuits and the transfer of microelectronic circuits or micro-systems onto all types of media
Mark Details
Serial Number
No 78316644
Mark Type
No Service Mark
Attorney Docket Number
No 044299/00000
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 08th Nov 2013 | CANCELLED SEC. 8 (6-YR) |
| 07th Feb 2011 | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP |
| 21st Dec 2008 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| 21st Dec 2008 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| 03rd Apr 2007 | REGISTERED-PRINCIPAL REGISTER |
| 24th Jan 2007 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| 16th Jan 2007 | PUBLISHED FOR OPPOSITION |
| 08th Jan 2007 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| 27th Dec 2006 | NOTICE OF PUBLICATION |
| 14th Dec 2006 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |