About 74 Trademarks found for “adte*”

AD TECH

COMPUTER SOFTWARE FOR MANAGING ACCOUNT INFORMATION, TRACKING THE VALUE OF SECURITIES, TRACKING INTEREST ACCRUAL ON LOANS AND SAVINGS ACCOUNTS, AND MANAGING ALL ACCOUNTS HELD BY A BANK, IN THE FIELD OF THE FINANCIAL SERVICES INDUSTRY

ADD TEXT

"INFORMATION SYSTEMS, INC."

PRODUCTION OF CUSTOMIZED ADVERTISING MESSAGES AND MUSICAL SELECTIONS THAT ARE PLAYED BACK OVER THE TELEPHONE WHILE THE LISTENER IS ON HOLD

Advertising agency services; and advertising services, namely, advertising the [ goods, services and ] legal notices of others by receiving advertising copy from advertisers, modifying advertising copy, and transmitting copy to electronic and print publications

THE DRAWING IS AMENDED TO APPEAR AS FOLLOWS: ADTECH

Ceramic and metal electronic components, namely, single and multi-layer co-fire ceramic packages, ceramic packages, ceramic packaging, multi layer ceramics and brazed assemblies therefor all for micro electronic high reliability applications for use in combination with microchips, resistors and capacitors; ceramic chip scale packaging, namely, integrated circuit packages that contact pads instead of pins or wires; ceramic pin grid arrays and ceramic ball grid arrays all in the nature of configurations for microprocessor sockets on computer motherboards; multi chip integrated circuit modules; feedthroughs, namely, ceramic co-fired conductors hermetically connecting two circuits on opposite sides of a metal housing; heat spreaders for removing heat from high power devices in a ceramic package; leadless ceramic chip carriers, namely, semiconductor chip housings; brazed metal electronic assemblies, namely, quad flat packs and dual in-line packages for use with integrated circuits

ADVANCED TECHNICAL CERAMICS

CERAMIC AND METAL ELECTRONIC COMPONENTS, NAMELY, SINGLE AND MULTI-LAYER CO-FIRE CERAMIC PACKAGES, CERAMIC PACKAGES, CERAMIC PACKAGING, MULTI LAYER CERAMICS AND BRAZED ASSEMBLIES THEREFOR ALL FOR MICRO ELECTRONIC HIGH RELIABILITY APPLICATIONS FOR USE IN COMBINATION WITH MICROCHIPS, RESISTORS AND CAPACITORS; CERAMIC CHIP SCALE PACKAGING, NAMELY, INTEGRATED CIRCUIT PACKAGES THAT CONTACT PADS INSTEAD OF PINS OR WIRES; CERAMIC PIN GRID ARRAYS AND CERAMIC BALL GRID ARRAYS ALL IN THE NATURE OF CONFIGURATIONS FOR MICROPROCESSOR SOCKETS ON COMPUTER MOTHERBOARDS; MULTI CHIP INTEGRATED CIRCUIT MODULES; FEEDTHROUGHS, NAMELY, CERAMIC CO-FIRED CONDUCTORS HERMETICALLY CONNECTING TWO CIRCUITS ON OPPOSITE SIDES OF A METAL HOUSING; HEAT SPREADERS FOR REMOVING HEAT FROM HIGH POWER DEVICES IN A CERAMIC PACKAGE; LEADLESS CERAMIC CHIP CARRIERS, NAMELY, SEMICONDUCTOR CHIP HOUSINGS; BRAZED METAL ELECTRONIC ASSEMBLIES, NAMELY, QUAD FLAT PACKS AND DUAL IN-LINE PACKAGES FOR USE WITH INTEGRATED CIRCUITS

"CERAMICS"

ADTEGRITY INTERNATIONAL INC