NOTICE OF ALLOWANCE - ISSUED
issued
on 18 Jun 2024
Last Applicant/ Owned by
10140 E Caron Street
Scottsdale
US
AZ
85258
Serial Number
97767075 filed on 25th Jan 2023
Registration Number
N/A
Correspondent Address
Daniel R. Frijouf
Filing Basis
1. intent to use
2. intent to use current
Disclaimer
NO DATA
QCIA
Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterni Read More
Classification Information
Class [042]
Computer & Software Services & Scientific Services
Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking
First Use Date in General
N/A
First Use Date in Commerce
N/A
Class [009]
Computer & Software Products & Electrical & Scientific Products
Silicon substrates, namely, silicon wafers, silicon wafer carriers, silicon wafer substrates; silicon carbide substrates, namely, silicon carbide wafers, silicon carbide wafer carriers, silicon carbide substrates, semiconductor wafers of silicon carbide insulating wafer of silicon carbide, semi insulating wafers of silicon carbide and dielectric wafers built on silicon carbide; semiconductor substrates, namely, organic multilayer laminates supporting silicon carbide chips, organic multilayer laminate supporting non silicon carbide semiconductor wafers, semiconductor substrates supporting optical interconnect, semiconductor substrate supporting electrical interconnect, semiconductor substrate supporting both optical and electrical interconnect together; semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; semiconductor power components, namely, silicone interposers; semiconductor power components, namely, silicon carbide interposers; semiconductor power components, namely, interposers for semiconductor packaging, chips and circuit boards; semiconductor packaging materials in the nature of semiconductor interposers, semiconductor substrates, semiconductor routing layers for packaging, packaging substrates, packaging thermal management substrates, packaging heat spreading device, packaging power delivery device
First Use Date in General
N/A
First Use Date in Commerce
N/A
Mark Details
Serial Number
No 97767075
Mark Type
No Service Mark
Attorney Docket Number
No SALAMA.22005
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 17th Dec 2024 | SOU TEAS EXTENSION RECEIVED |
| 18th Jun 2024 | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
| 23rd Apr 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| 23rd Apr 2024 | PUBLISHED FOR OPPOSITION |
| 03rd Apr 2024 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| 19th Mar 2024 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| 12th Feb 2024 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| 12th Feb 2024 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| 12th Feb 2024 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| 13th Nov 2023 | NOTIFICATION OF PRIORITY ACTION E-MAILED |