About 6 Trademarks found that are owned by Xsemi Corporation

Transistors; Diodes; Electric power converters; Silicon wafers; Silicon chips; Photomask substrates, namely, synthetic quartz glass plates being structural parts of excimer steppers, for use in fabrication of integrated circuits; Semiconductors; Integrated circuits; Semiconductor chips; Semiconductor components, namely, rectifier diodes, Schottky diodes, transient voltage suppressor diodes, bipolar transistors, insulated-gate bipolar transistors (IGBT), Si-MOSFETs, SiC-MOSFETs, Si-diodes; SiC-diodes; Circuit boards provided with integrated circuits; Wafers for integrated circuits; Semiconductor devices; Microchips; Voltage regulators; Current rectifiers; High definition multimedia interface splitters

Research and development in the field of Semiconductor electronics in industrial, automotive, communication and personal electronics; Research and development of new products for others; Design of integrated circuits; Design of semiconductor chips

The color(s) red is/are claimed as a feature of the mark.

Research and development in the field of Semiconductor electronics in industrial, automotive, communication and personal electronics; Research and development of new products for others; Design of integrated circuits; Design of semiconductor chips

The color(s) red is/are claimed as a feature of the mark.

Research and development in the field of Semiconductor electronics in industrial, automotive, communication and personal electronics; Research and development of new products for others; Design of integrated circuits; Design of semiconductor chips

Color is not claimed as a feature of the mark.

Research and development in the field of Semiconductor electronics in industrial, automotive, communication and personal electronics; Research and development of new products for others; Design of integrated circuits; Design of semiconductor chips

Color is not claimed as a feature of the mark.

Research and development in the field of Semiconductor electronics in industrial, automotive, communication and personal electronics; Research and development of new products for others; Design of integrated circuits; Design of semiconductor chips

CMOS image sensor packaging in the nature of integrated circuit assembly; Semiconductor packaging in the nature of integrated circuit assembly; Manufacturing processing of semiconductors, wafers, and integrated circuits for others; Assembly of semiconductors, wafers, and integrated circuits for others; Packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; Metal laminating; Laminating of plastic, metal, ceramic or glass sheets; Laminating of plastic sheets; Molding of plastic materials

Integrated circuit modules; Electronic integrated circuits; Circuit boards provided with integrated circuits; Semiconductor chips; Computer chips; Integrated circuit modules for use with infrared detectors; Chip carriers, namely, semiconductor chip housings; Integrated circuits; Photoelectric sensors; Infrared sensors; Optical lenses; Optical mirrors; Printed circuit boards; Rearview cameras for vehicles