About 9 Trademarks found that are owned by Synova Sa

[ Machines for machining workpieces, namely, drilling machines, cutting machines, grinding machines, dicing machines; machines for turbine blade machining, namely, drilling machines, cutting machines, grinding machines, dicing machines; machines for machining workpieces by water-jet and laser; machines for electrical discharge machining (EDM) of workpieces ]

Treatment of materials, namely, metals, composites and carbon-derived materials; treatment of turbine blade materials, namely, metals, composites and carbon-derived materials; treatment of materials by water-jet and laser; treatment of materials by electrical discharge machining (EDM); treatment of materials, namely, metals, composites and carbon-derived materials, by two or more different working methods

Lasers, not for medical purposes

Machines for laser surface treatment of materials, namely, for severing silicon wafers or other crystalline materials for semi-conductor devices into microchips

Lasers for medical use, water-jet-guided lasers for medical use

Treatment of materials in the nature of ceramics, diamond, polycrystalline diamond, gemstone, precious stones, carbide, metal, semiconductors, carbon, composite material of the previous types by means of laser and water jet for third parties; treatment of materials in the nature of ceramics, diamond, polycrystalline diamond, precious stones, carbide, semiconductors by water-jet-guided laser for third parties

Treatment of materials for third parties, namely, ceramic, ceramic composite, diamond, polycrystalline diamond, gemstone, carbide metal, semiconductor material, by laser and waterjet, excluding treatment of materials for the manufacture of dental products or for dental treatment in humans

Software for controlling lasers for processing materials, namely, ceramic, ceramic composite, diamond, polycrystalline diamond, gemstone, carbide metal, semi-conductor material, excluding software for the manufacture of dental products or for dental treatment in humans; Software for controlling lasers for ablating materials, namely, ceramic, diamond, polycrystalline diamond, gemstone, carbide metal, semi-conductor material, by means of laser and water jet excluding software for the manufacture of dental products or for dental treatment in humans; lasers for non-medical use excluding lasers for the manufacture of dental products or for dental treatment in humans

Treatment of materials for third parties, namely, ceramic, diamond, polycrystalline diamond, gemstone, carbide metal, semiconductor, by means of laser and water jet

Software for controlling lasers for processing materials, namely, ceramic, diamond, polycrystalline diamond, gemstone, carbide metal, semiconductor; Software for controlling machines for ablating materials, namely, ceramic, diamond, polycrystalline diamond, gemstone, carbide metal, semiconductor, by means of laser and water jet laser for non-medical use

Machines for processing materials, namely, metal cutting machines; machines for processing semiconductor materials, namely, wafers; semiconductor wafer cutting machines; machines for producing microchips, namely, machines for laser surface treatment of materials for severing silicon wafers or other crystalline materials for semi-conductor devices into microchips

Machines for processing materials by means of laser cutting, in particular laser cutting machines wherein the laser beam is guided in a water jet

LASER TAPE

MICRO JET

treatment of materials, namely, precision laser processing of industrial materials made of metals, plastics, glass, ceramics and wood including surface treatment