About 19 Trademarks found that are owned by Ibg Immobilien Und Beteiligungs Gmbh

SMART CLEAVE

Technical consultancy relating to manufacturing methods and devices in the field of semi-conductor technology; research and development relating to manufacturing methods and devices in the field of semi-conductor technology; technical project planning relating to manufacturing methods and devices in the field of semi-conductor technology; Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices; Design and Development of Computer hardware and Software

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class

LOW TEMP DEBOND

The following "the aforesaid goods included in class 7 being exclusively in the field of semiconductor technology" should be inserted at the end of class 7. "The aforesaid services included in class 42 being exclusively in the field of semiconductor technology" should be inserted at end of the class 42.

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly; * the aforesaid goods included in class 7 being exclusively in the field of semiconductor technology *

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly

[Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices]

Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; research and development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering, for others, in relation to methods and devices in the field of semiconductor technology

Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly

EASY BOND

EASY B

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly

"DEBOND"

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly