| Logo Mark HEJIAN TECHNOLOGY (SUZHOU) CO., LTD.
79041612 11 Jul 2007 | on 12 Jul 2017 | Burnishing by abrasion; custom assembling of materials for others, nam... Class 009 Class 009 Computer & Software Products & Electrical & Scientific Products Burnishing by abrasion; custom assembling of materials for others, namely, custom assembly of semiconductors and integrated circuits for others according to customer specifications, custom manufacture of semiconductors, integrated circuits, computer chips, and semiconductor wafers; soldering; grinding; treatment of metal; metal plating; key cutting Class 040 Class 040 Treatment & Processing of Materials Services Computer programs for use in operating, testing and analyzing semiconductors; microprocessors; central processing units; blank integrated circuit cards, blank smart cards and blank subscriber identity module (SIM) cards for use in consumer electronic products; semiconductors, namely, semiconductor memories, semiconductor memory units; semiconductor wafers comprising germanium and silicon; integrated circuit; computer chips, namely, computer logic chips, mixed signal computer chips, high voltage computer chips and computer memory chips; semiconductor devices, namely, semiconductor logic chips, mixed signal semiconductor chips, high voltage semiconductor chips, and semiconductor memory chips; electronic sensors, namely, complementary metal-oxide semiconductor image sensors for converting optical images to electrical signals Class 042 Computer & Software Services & Scientific Services Color is not claimed as a feature of the mark. | | | HJTC HEJIAN TECHNOLOGY (SUZHOU) CO., LTD.
79043928 06 Jul 2007 | on 07 Jul 2017 | Burnishing by abrasion; custom assembling of materials for others, nam... Class 009 Class 009 Computer & Software Products & Electrical & Scientific Products Burnishing by abrasion; custom assembling of materials for others, namely, custom assembly of semiconductors and integrated circuits for others according to customer specifications, custom manufacture of semiconductors, integrated circuits, computer chips, and semiconductor wafers; soldering; grinding; treatment of metal; metal plating; key cutting Class 040 Class 040 Treatment & Processing of Materials Services Computer programs for use in operating, testing and analyzing semiconductors; microprocessors; central processing units; Blank integrated circuit cards, blank smart cards and blank subscriber identity module (SIM) cards for use in consumer electronic products; semiconductors, namely, semiconductor memories, semiconductor memory units; semiconductor wafers comprising germanium and silicon; integrated circuit; computer chips, namely, computer logic chips, mixed signal computer chips, high voltage computer chips and computer memory chips; semiconductor devices, namely, semiconductor logic chips, mixed signal semiconductor chips, high voltage semiconductor chips, and semiconductor memory chips; electronic sensors, namely, complementary metal-oxide semiconductor image sensors for converting optical images to electrical signals Class 042 Computer & Software Services & Scientific Services Burnishing by abrasion; custom assembling of materials for others, namely, custom assembly of semiconductors and integrated circuits for others according to customer specifications, custom manufacture of semiconductors, integrated circuits, computer chips, and semiconductor wafers; soldering; grinding; treatment of metal; metal plating; key cutting | | | HEJIAN HEJIAN TECHNOLOGY (SUZHOU) CO., LTD.
79044006 06 Jul 2007 | on 07 Jul 2017 | Burnishing by abrasion; custom assembling of materials for others, nam... Class 009 Class 009 Computer & Software Products & Electrical & Scientific Products Burnishing by abrasion; custom assembling of materials for others, namely, custom assembly of semiconductors and integrated circuits for others according to customer specifications, custom manufacture of semiconductors, integrated circuits, computer chips, and semiconductor wafers; soldering; grinding; treatment of metal; metal plating; key cutting Class 040 Class 040 Treatment & Processing of Materials Services Computer programs for use in operating, testing and analyzing semiconductors; microprocessors; central processing units; Blank integrated circuit cards, blank smart cards and blank subscriber identity module (SIM) cards for use in consumer electronic products; semiconductors, namely, semiconductor memories, semiconductor memory units; semiconductor wafers comprising germanium and silicon; integrated circuit; computer chips, namely, computer logic chips, mixed signal computer chips, high voltage computer chips and computer memory chips; semiconductor devices, namely, semiconductor logic chips, mixed signal semiconductor chips, high voltage semiconductor chips, and semiconductor memory chips; electronic sensors, namely, complementary metal-oxide semiconductor image sensors for converting optical images to electrical signals Class 042 Computer & Software Services & Scientific Services Technical research, namely, research and development of new products for others; technological consultation services in the technology field of semiconductors, semiconductor wafers and integrated circuits; technical project studies, namely, providing technology consultation services for others in the field of semiconductor design and semiconductor engineering; research and development for others, namely, custom design and testing for new product development regarding electrical and electronic products, semiconductors, wafer and integrated circuits, design of photo masks for the production of integrated circuits for others; quality control testing of semiconductors and integrated circuits for others; material testing; packaging design services; computer programming for others; computer software design for others; computer system design for others | | 
