| ACOUSTILEAD FRY'S METALS INC.
72331711 03 Jul 1969 | on 01 Apr 2016 | LEAD SHEETS,LEAD SHEETS Class 014 Class 014 Jewelry Products LEAD SHEETS | | | CEN-TRI-CORE FRY'S METALS, INC.
71608139 28 Dec 1950 | on 01 Apr 2016 | SOLDER,SOLDER Class 014 Class 014 Jewelry Products THE WORD "CORE" IS DISCLAIMED APART FROM THE MARK AS SHOWN. | | | OSTALLOY FRY'S METALS, INC.
72411467 30 Dec 1971 | on 11 Mar 2016 | METAL ALLOYS,METAL ALLOYS Class 014 Class 014 Jewelry Products METAL ALLOYS | | | AQUA CLEAN FRY'S METALS, INC.
74011057 15 Dec 1989 | on 22 Jan 2016 | LEAD-FREE SOLDER ALLOY,LEAD-FREE SOLDER ALLOY Class 001 Class 001 Chemical Products LEAD-FREE SOLDER ALLOY | | | ALPHA-FRY TECHNOLOGIES Fry's Metals, Inc.
76057743 25 May 2000 | on 20 Jul 2012 | ORGANIC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; S... Class 001 Class 001 Chemical Products ORGANIC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; SOLDERING AND PRINTED CIRCUIT CHEMICALS, NAMELY, ALKALI CLEANERS, DEGREASING SOLVENTS, FLUX REMOVER, METAL CLEANER, PAINT STRIPPERS AND VARNISH REMOVER, WIRE STRIPPING PREPARATION FOR REMOVING INSULATION FROM METAL, SILK SCREEN INK REMOVER, SOLDER RESIST REMOVING PREPARATION; SOLVENT AND AQUEOUS CLEANERS TO REMOVE RESIDUES AND CONTAMINANTS BEFORE AND AFTER SOLDERING; CHEMICAL CLEANER AND ROSIN FLUX REMOVER FOR USE IN ROSIN MILDLY ACTIVATED PASTE APPLICATIONS, NAMELY, CLEANING COMPOUND FOR SOLDER PLATED PRINTED CIRCUITS Class 003 Class 003 Cosmetics and Cleaning Products TIN AND LEAD EUTECTIC SOLDER; WATER SOLUBLE ORGANIC FLUX CORED SOLDER WIRE; COATED METAL STRIP; SOLDERS COMPOSED PRIMARILY OF LEAD AND TIN; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER; LASER CUT METAL STENCILS FOR USE IN THE ASSEMBLY OF ELECTRONIC COMPONENTS; SOLDER METAL ALLOY THAT IS TREATED TO INHIBIT DROSS FORMATION AND INCREASE FLUIDITY FOR USE IN SOLDERING APPLICATIONS; PASTES CONTAINING METAL POWDER FOR USE IN COPPER BRAZING; FLUX CORED WIRE SOLDER FOR USE IN THE ELECTRONICS INDUSTRY ORGANIC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; SOLDERING AND PRINTED CIRCUIT CHEMICALS, NAMELY, ALKALI CLEANERS, DEGREASING SOLVENTS, FLUX REMOVER, METAL CLEANER, PAINT STRIPPERS AND VARNISH REMOVER, WIRE STRIPPING PREPARATION FOR REMOVING INSULATION FROM METAL, SILK SCREEN INK REMOVER, SOLDER RESIST REMOVING PREPARATION; SOLVENT AND AQUEOUS CLEANERS TO REMOVE RESIDUES AND CONTAMINANTS BEFORE AND AFTER SOLDERING; CHEMICAL CLEANER AND ROSIN FLUX REMOVER FOR USE IN ROSIN MILDLY ACTIVATED PASTE APPLICATIONS, NAMELY, CLEANING COMPOUND FOR SOLDER PLATED PRINTED CIRCUITS | | | FRY TECHNOLOGY Fry's Metals, Inc.
75451284 16 Mar 1998 | on 08 Jun 2012 | industrial metal and metal-based materials, namely, solder and solder ... Class 001 Class 001 Chemical Products "TECHNOLOGY" Class 006 industrial metal and metal-based materials, namely, solder and solder alloys for use in industrial welding | | | 4X NICKEL Fry's Metals, Inc.
75721511 04 Jun 1999 | on 04 Nov 2011 | Metal alloys, namely, metal alloys classified as babbitt-type metal al... Class 006 Metal alloys, namely, metal alloys classified as babbitt-type metal alloys and containing minor additions of nickel for use in metal joining of metal parts provided in sheet, rod, wire and powder form | | | ALPHA DIMENSIONS Fry's Metals, Inc.
78103044 16 Jan 2002 | on 03 Dec 2010 | manufacture of printed circuit board stencils to order and/or specific... Class 035 Class 035 Advertising, Business & Retail Services manufacture of printed circuit board stencils to order and/or specification of others Class 040 Class 040 Treatment & Processing of Materials Services On-line ordering services featuring printed circuit board stencils | | | ULTRA FLAT Fry's Metals, Inc.
77846624 12 Oct 2009 | on 28 Oct 2010 | SOLDER AND SOLDER PREFORMS,SOLDER AND SOLDER PREFORMS Class 006 SOLDER AND SOLDER PREFORMS | | | STAYCHIP Fry's Metals, Inc.
76068543 09 Jun 2000 | on 06 Feb 2010 | UNDERFILL AND ENCAPSULANT MATERIALS, NAMELY THERMOPLASTIC OR THERMOSET... Class 017 UNDERFILL AND ENCAPSULANT MATERIALS, NAMELY THERMOPLASTIC OR THERMOSET POLYMERIC MATERIALS USED IN ASSEMBLY OF PRINTED CIRCUIT BOARDS OR SEMICONDUCTOR PACKAGING | |