Mark	Details	Status	Class/Description
	CUP-PLATER Electroplating Engineers of Japan Ltd. 74728652 13 Sep 1995	Dead/Cancelled on 19 Dec 2009	bump plating machine for wafer,bump plating machine for wafer Class 009 Class 009 Computer & Software Products & Electrical & Scientific Products bump plating machine for wafer			CUPLAND ELECTROPLATING ENGINEERS OF JAPAN LTD. 75310017 16 Jun 1997	Dead/Cancelled on 28 Jul 2007	electroplating machines,electroplating machines Class 007 Class 007 Machinery Products electroplating machines			POSPEC Electroplating Engineers of Japan Ltd. 74735250 20 Sep 1995	Dead/Cancelled on 22 May 2004	inspection sorting machine for plated bump height and bump size of sem... Class 007 Class 007 Machinery Products inspection sorting machine for plated bump height and bump size of semiconductor wafer

Mark

Details

Status

Class/Description

CUP-PLATER

Electroplating Engineers of Japan Ltd.

74728652

13 Sep 1995

Dead/Cancelled

on 19 Dec 2009

bump plating machine for wafer,bump plating machine for wafer

Class 009

CUPLAND

ELECTROPLATING ENGINEERS OF JAPAN LTD.

75310017

16 Jun 1997

Dead/Cancelled

on 28 Jul 2007

electroplating machines,electroplating machines

Class 007

POSPEC

Electroplating Engineers of Japan Ltd.

74735250

20 Sep 1995

Dead/Cancelled

on 22 May 2004

inspection sorting machine for plated bump height and bump size of sem...

Class 007

Dead/Cancelled

on 19 Dec 2009

CUP-PLATER

Electroplating Engineers of Japan Ltd.

74728652 · 13 Sep 1995

009

bump plating machine for wafer,CUP PLATER,bump plating machine for waf...

Dead/Cancelled

on 28 Jul 2007

CUPLAND

ELECTROPLATING ENGINEERS OF JAPAN LTD.

75310017 · 16 Jun 1997

007

electroplating machines,CUPLAND,electroplating machines,CUPLAND

Dead/Cancelled

on 22 May 2004

POSPEC

Electroplating Engineers of Japan Ltd.

74735250 · 20 Sep 1995

007

inspection sorting machine for plated bump height and bump size of sem...

Status

All

Registered

Pending

Abandoned

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