About 26 Trademarks found that are owned by Advanced Semiconductor Engineering Inc.

The color(s) green, yellow, orange, and blue is/are claimed as a feature of the mark.

Chips being integrated circuits; circuit board; semiconductors; semiconductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached; micro-circuit; integrated circuits; electronic circuit; printed circuit boards; semiconductor chip; semiconductor components, namely, integrated circuits, diodes, transistors, components for interconnecting semiconductors; integrated circuit board; semiconductor wafers; semiconductor packages, namely, semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules

Color is not claimed as a feature of the mark.

Technology research and development for others in the field of semiconductor related products; integrated circuits design; semiconductor packaging design; semiconductor substrate design; quality control inspection for semiconductors and related products; testing of semiconductors and related products; quality identification, namely, quality control inspection of semiconductors and related products; consulting with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development

ADVANCED SEMICONDUCTOR THREE

Color is not claimed as a feature of the mark.

The mark consists of a generally circular form containing two dots and a curved line generally representing a smiley face, with the circle surrounded by triangles.

Etching and processing of semiconductor wafers; etching and processing of integrated circuits; processing of semiconductor wafers; processing of semiconductor packaging and integrated circuit packaging; wafer manufacturing; manufacturing and processing of substrates; manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards and semiconductor wafers to the order and specification of others

Etching processing in the semiconductor wafer; manufacture of semiconductor, Integrated circuit, Integrated circuit board and wafer specified in the standard from customers; semiconductor packaging processing in the nature of manufacturing services for others; etching processing in integrated circuits; semiconductor wafer-level processing; wafer foundry, namely, manufacturing of semiconductor wafers for others; integrated circuit packaging processing in the nature of manufacturing services for others; semiconductor substrate processing and manufacturing; substrate foundry, namely, manufacturing of semiconductor substrates for others; manufacture of semiconductor substrate

Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers, integrated circuits; integrated circuits that contain metal bumps; semiconductor substrate

Etching and processing in the nature of custom manufacture of semiconductor wafers; etching and processing in the nature of custom manufacture of integrated circuits; processing in the nature of custom manufacture of semiconductor wafers; custom wafer manufacturing; custom manufacturing and processing in the nature of custom manufacture of substrates; manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards and semiconductor wafers to the order and specification of others

The mark consists of a half sun, half moon character with a smiling face.

Integrated circuit chips; circuit boards; semiconductors; semiconductor devices; integrated circuits; electronic integrated circuits; printed circuit boards; semiconductors chips; integrated circuit boards and semiconductor wafers

ADVANCED SEMICONDUCTOR ENGINEERING

Design for others of semiconductor packages; Consulting service in the field of Semiconductor Electro-Mechanical Engineering

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; Semiconductor processing, namely, treatment of semiconductor devices

Custom manufacture of integrated semiconductor packages in the nature of semiconductor chip housings and semiconductor integrated circuit modules

Custom design, product failure analysis and testing for new product development; technology consultation services regarding semiconductor chip housings and semiconductor integrated circuit modules

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; Semiconductor processing, namely, treatment of semiconductor devices

Design for others of semiconductor packages; Consulting service in the field of Semiconductor Electro-Mechanical Engineering