failure to respond or late response
on 24 Oct 2024
Last Applicant/ Owned by
Naniwa-ku, Osaka-shi Osaka 556-0022
JP
Serial Number
79383794 filed on 21st Jul 2023
Registration Number
N/A
Correspondent Address
2-8, Bakuromachi 3-Chome,
Osaka 541-0059,
JAPAN
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
Hydrophilic chemical agents for industrial purposes; detergents for industrial use; chemicals; chemically reactive solutions for use with abrasives for semiconductors; chemically reactive solutions for use with abrasives for electronic substrates; auxiliary fluids for use with abrasives Abrasive paper (sand paper); abrasive cloth; abrasive sand; polishing paper; polishing preparations; semiconduc Read More
Work holding instruments for semiconductor wafer polishing machines and apparatus; templates for semiconductor wafer polishing machines and apparatus; blank templates for semiconductor wafer polishing machines and apparatus; mounting pads and sheets for semiconductor wafer polishing machines and apparatus; polishing pads for semiconductor wafer polishing machines and apparatus; conditioners used for polishing pads for semiconductor wafer polishing machines and apparatus; semiconductor wafer polishing machines and apparatus; parts and accessories of semiconductor wafer polishing machines and apparatus; semiconductor manufacturing machines and apparatus; work holding instruments for glass polishing machines and apparatus; templates for glass polishing machines and apparatus; blank templates for glass polishing machines and apparatus; mounting pads and sheets for glass polishing machines and apparatus; polishing pads for glass polishing machines and apparatus; conditioners used for polishing pads for glass polishing machines and apparatus; glass polishing machines and apparatus; parts and accessories of glass polishing machines and apparatus; work holding instruments for glass substrate polishing machines and apparatus; templates for glass substrate polishing machines and apparatus; blank templates for glass substrate polishing machines and apparatus; mounting pads and sheets for glass substrate polishing machines and apparatus; polishing pads for glass substrate polishing machines and apparatus; conditioners used for polishing pads for glass substrate polishing machines and apparatus; glass substrate polishing machines and apparatus; parts and accessories of glass substrate polishing machines and apparatus; work holding instruments for polishing machines and apparatus for manufacturing hard disks; templates for polishing machines and apparatus for manufacturing hard disks; blank templates for polishing machines and apparatus for manufacturing hard disks; mounting pads and sheets for polishing machines and apparatus for manufacturing hard disks; polishing pads for polishing machines and apparatus for manufacturing hard disks; conditioners used for polishing pads for polishing machines and apparatus for manufacturing hard disks; polishing machines and apparatus for manufacturing hard disks; parts and accessories of polishing machines and apparatus for manufacturing hard disks; work holding instruments for electric polishing machines and apparatus; templates for electric polishing machines and apparatus; blank templates for electric polishing machines and apparatus; mounting pads and sheets for electric polishing machines and apparatus; polishing pads for electric polishing machines and apparatus; conditioners used for polishing pads for electric polishing machines and apparatus; electric polishing machines and apparatus; parts and accessories of electric polishing machines and apparatus; polishing pads for electric polishing machines; polishing cloths used as parts or accessories of electric polishing machines
N/A
N/A
Abrasive paper (sand paper); abrasive cloth; abrasive sand; polishing paper; polishing preparations; semiconductor polishing slurries; electronic substrate polishing slurries; polishing slurries; abrasive preparations; pads impregnated with polishing preparations; impregnated cloths for polishing; grinding preparations; sharpening preparations; abrasives; scouring solutions; metal polishes; hydrophilic agents for industrial polishing; chemical slurries for polishing semiconductors; chemical slurries for polishing electronic substrates
N/A
N/A
Hydrophilic chemical agents for industrial purposes; detergents for industrial use; chemicals; chemically reactive solutions for use with abrasives for semiconductors; chemically reactive solutions for use with abrasives for electronic substrates; auxiliary fluids for use with abrasives
N/A
N/A
No 79383794
No Service/Collective Mark
No
No
No
No
No
Yes
Yes
No
No
09.07.08 -
Parts of footwear
26.17.09 -
Curved line(s), band(s) or bar(s)
Status Date | Action Taken |
---|---|
24th Oct 2024 | ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND |
24th Oct 2024 | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE |
08th Apr 2024 | REFUSAL PROCESSED BY IB |
19th Mar 2024 | REFUSAL PROCESSED BY MPU |
19th Mar 2024 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
27th Feb 2024 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
26th Feb 2024 | NON-FINAL ACTION WRITTEN |
14th Feb 2024 | ASSIGNED TO EXAMINER |
05th Dec 2023 | APPLICATION FILING RECEIPT MAILED |
01st Dec 2023 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |