SECTION 8-ACCEPTED
accepted
on 02 Feb 2024
Last Applicant/ Owned by
1-11-1, Osaki, Shinagawa-ku
Tokyo
JP
141-8584
Serial Number
87599649 filed on 07th Sep 2017
Registration Number
5562514 registered on 11th Sep 2018
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
NANOBIX
Abrasive slurry for chemical mechanical polishing, namely, chemical slurries for polishing semiconductors; Abrasive slurry being chemical slurries for polishing semiconductors; Abrasive slurry for substrate; Abrasive slurry for semiconductor, namely, chemical slurries for polishing semiconductors
Classification Information
Class [001]
Chemical Products
Abrasive slurry for chemical mechanical polishing, namely, chemical slurries for polishing semiconductors; Abrasive slurry being chemical slurries for polishing semiconductors; Abrasive slurry for substrate; Abrasive slurry for semiconductor, namely, chemical slurries for polishing semiconductors
First Use Date in General
20th Jun 2011
First Use Date in Commerce
28th Feb 2013
Specimens
Mark Details
Serial Number
No 87599649
Mark Type
No Service/Collective Mark
Attorney Docket Number
No 178174
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 02th Feb 2024 | REGISTERED - SEC. 8 (6-YR) ACCEPTED |
| 02th Feb 2024 | NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED |
| 01st Feb 2024 | TEAS RESPONSE TO OFFICE ACTION-POST REG RECEIVED |
| 02th Jan 2024 | POST REGISTRATION ACTION MAILED - SEC. 8 |
| 12th Dec 2023 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| 12th Sep 2023 | TEAS SECTION 8 RECEIVED |
| 11th Sep 2023 | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED |
| 11th Sep 2018 | REGISTERED-PRINCIPAL REGISTER |
| 07th Aug 2018 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
| 04th Aug 2018 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |