on 13 Aug 2019
Last Applicant/ Owned by
Nishikyo-ku, Kyoto-shi, Kyoto 615-8245
JP
Serial Number
79233681 filed on 05th Mar 2018
Registration Number
5830583 registered on 13th Aug 2019
Correspondent Address
Washington, DC 20036
UNITED STATES
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
Semiconductor manufacturing machines and systems, namely, chemical vapor deposition machines used for semiconductor manufacturing, halide vapor phase epitaxy machines used for semiconductor manufacturing, dicing machine, packaging machine, plastic molding machine, and wire-bonding machine; semiconductor manufacturing machine parts and accessories, namely, ultrasonic transducers, heaters, mist gene Read More
Telecommunication devices and apparatus, namely, apparatus for transmission of communication, telephone apparatus, video telephones, mobile telephones, and smartphones; semiconductors; semiconductor devices; electronic machines, apparatus and their parts, namely, electrical semi-conductor power elements, electronic circuits, optical instruments in the nature of optical couplers, optical transmitters, optical receivers; diodes, integrated circuits, and electric power distribution and control machines and units; measuring or testing machines, instruments and their parts, namely, measuring apparatus in the nature of electric sensors and scales for measuring the growth of films, and electric sensors for measuring characteristics of films; laboratory apparatus, instruments and their parts, namely, physical and chemical laboratory apparatus and instruments in the nature of electric sensors and scales; measurement apparatus in the nature of electric sensors, scales, and laboratory chemical reactors; electronic circuits; electrical circuit boards
N/A
N/A
Semiconductor manufacturing machines and systems, namely, chemical vapor deposition machines used for semiconductor manufacturing, halide vapor phase epitaxy machines used for semiconductor manufacturing, dicing machine, packaging machine, plastic molding machine, and wire-bonding machine; semiconductor manufacturing machine parts and accessories, namely, ultrasonic transducers, heaters, mist generators, atomizers, film-formation chambers, gas distributing valves, reactors, gas-supply pipes, hot plates, susceptors being holders, and dicing blades; chemical processing machines and apparatus, namely, apparatus for chemical cleaning and mechanical surface treatment; glassware manufacturing machines; plastic processing machines; pneumatic or hydraulic machines and instruments, namely, compressed air pumps; valves being parts of machines
N/A
N/A
Metal plating; rental of plating machines; treatment of materials by application of thin films on the surfaces of objects by means of chemical, mechanical, thermal, thermomechanical, chemical vapor deposition, physical vapor deposition or vacuum deposition processes; laminating of crystal films, semiconductor films, electrically-conducting films, electrically-insulating films and semi-insulating films; metallizing; metal treating; custom manufacturing and assembling services relating to semi-conductor parts and integrated circuits; processing of chemicals and petrochemicals; treatment of materials by custom application of optical, transparent, solar reflective and wear-resistant coatings on metallic, organic and mineral substrates; treatment of materials by application of coatings using chemical, mechanical, thermal or thermomechanical processes; rental of metal treating machines and tools; providing information relating to the rental of metal treating machines and tools
N/A
N/A
No 79233681
No Service Mark
No TM18-6827
No
No
No
No
Yes
Yes
No
No
Status Date | Action Taken |
---|---|
13th Aug 2024 | COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED |
28th Dec 2019 | FINAL DECISION TRANSACTION PROCESSED BY IB |
10th Dec 2019 | FINAL DISPOSITION PROCESSED |
10th Dec 2019 | FINAL DISPOSITION NOTICE SENT TO IB |
13th Nov 2019 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
13th Aug 2019 | REGISTERED-PRINCIPAL REGISTER |
26th Jul 2019 | CHANGE OF NAME/ADDRESS REC'D FROM IB |
05th Jul 2019 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
28th May 2019 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
28th May 2019 | PUBLISHED FOR OPPOSITION |