on 26 Sep 2023
Last Applicant/ Owned by
Innovation Rd. I, Hsinchu Science Park
Hsinchu
TW
300092
Serial Number
97333701 filed on 28th Mar 2022
Registration Number
7177794 registered on 26th Sep 2023
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
Semi-conductors components, namely, semi-conductor memories, semi-conductor diodes, semi-conductor chips, structured semi-conductor wafers, semi-conductor transistors; integrated circuits; printed circuit boards; chip sets, namely, semiconductor chips sets comprised primarily of semiconductor chips, circuit board assemblies and integrated circuits; semi-conductor chip
Semi-conductors components, namely, semi-conductor memories, semi-conductor diodes, semi-conductor chips, structured semi-conductor wafers, semi-conductor transistors; integrated circuits; printed circuit boards; chip sets, namely, semiconductor chips sets comprised primarily of semiconductor chips, circuit board assemblies and integrated circuits; semi-conductor chip
17th Feb 1998
17th Jul 2022
No 97333701
No Service/Collective Mark
No 120369-US-TM
No
No
No
No
No
No
No
No
26.03.21 -
Ovals that are completely or partially shaded
26.17.09 -
Curved line(s), band(s) or bar(s)
Status Date | Action Taken |
---|---|
26th Sep 2023 | REGISTERED-PRINCIPAL REGISTER |
26th Sep 2023 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
22nd Aug 2023 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
21st Aug 2023 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
20th Aug 2023 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
20th Aug 2023 | STATEMENT OF USE PROCESSING COMPLETE |
09th Aug 2023 | TEAS STATEMENT OF USE RECEIVED |
09th Aug 2023 | USE AMENDMENT FILED |
11th Apr 2023 | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
14th Feb 2023 | PUBLISHED FOR OPPOSITION |