on 10 Sep 2024
Last Applicant/ Owned by
2 YISHUN AVENUE 7
SINGAPORE
SG
768924
Serial Number
90313487 filed on 11th Nov 2020
Registration Number
7502639 registered on 10th Sep 2024
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
machines for assembly of semiconductor components; bonding equipment, namely, die and flip chip bonders for semiconductor processing; semiconductor bonding machines
machines for assembly of semiconductor components; bonding equipment, namely, die and flip chip bonders for semiconductor processing; semiconductor bonding machines
30th Jun 2024
30th Jun 2024
No 90313487
No Service/Collective Mark
No TE/4076-474
No
No
No
No
No
No
No
No
Status Date | Action Taken |
---|---|
10th Sep 2024 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
10th Sep 2024 | REGISTERED-PRINCIPAL REGISTER |
05th Aug 2024 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
05th Aug 2024 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
10th Jul 2024 | STATEMENT OF USE PROCESSING COMPLETE |
03rd Jul 2024 | TEAS STATEMENT OF USE RECEIVED |
03rd Jul 2024 | USE AMENDMENT FILED |
09th Feb 2024 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
08th Feb 2024 | SOU EXTENSION 5 GRANTED |
08th Feb 2024 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |