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LAPLACE
Live/Registered
REGISTERED

on 27 Aug 2024

Last Applicant/ Owned by

Serial Number

79366808 filed on 23rd Feb 2023

Registration Number

7483930 registered on 27th Aug 2024

in the Principal Register

Correspondent Address

Jay G. Durst

Jay G. Durst Boyle Fredrickson S.C.

Milwaukee, WI 53203

United States

Filing Basis

1. filing basis filed as 66 a

Disclaimer

NO DATA

LAPLACE

Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds Automatic machines, namely, automatic bonding ma Read More

Classification Information


Class [042]
Computer & Software Services & Scientific Services


Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds


First Use Date in General

N/A

First Use Date in Commerce

N/A

Class [040]
Treatment & Processing of Materials Services


Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material


First Use Date in General

N/A

First Use Date in Commerce

N/A

Class [007]
Machinery Products


Automatic machines, namely, automatic bonding machines with respect to micro periphery; machines, namely, automatic bonding machines, for the application of connecting material on substrates; machines, namely, automatic bonding machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module


First Use Date in General

N/A

First Use Date in Commerce

N/A

Class [006]
Metal Products


Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds


First Use Date in General

N/A

First Use Date in Commerce

N/A

Mark Details


Serial Number

No 79366808

Mark Type

No Service Mark

Attorney Docket Number

No 696.114

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

Yes

66A Current

Yes

Current Basis

No

No Basis

No

Legal History


Show more

Status DateAction Taken
27th Nov 2024FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
27th Aug 2024NOTICE OF REGISTRATION CONFIRMATION EMAILED
27th Aug 2024REGISTERED-PRINCIPAL REGISTER
11th Jun 2024OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
11th Jun 2024PUBLISHED FOR OPPOSITION
22nd May 2024NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
06th May 2024APPROVED FOR PUB - PRINCIPAL REGISTER
03rd May 2024TEAS RESPONSE TO OFFICE ACTION RECEIVED
03rd May 2024TEAS/EMAIL CORRESPONDENCE ENTERED
03rd May 2024CORRESPONDENCE RECEIVED IN LAW OFFICE