REGISTERED AND RENEWED
on 10 Mar 2022
Last Applicant/ Owned by
4280 W. Opportunity Way
Phoenix
AZ
85086
Serial Number
75858766 filed on 29th Nov 1999
Registration Number
2499629 registered on 23rd Oct 2001
Filing Basis
1. use application currently
Disclaimer
NO DATA
KETECA
Lubricants used for reducing heat and friction when cutting, grinding and shaping silicon wafers Chemical solutions and surfactants used for reducing heat and friction when cutting, grinding and shaping silicon wafers
Classification Information
Class [001]
Chemical Products
Chemical solutions and surfactants used for reducing heat and friction when cutting, grinding and shaping silicon wafers
First Use Date in General
11th May 1995
First Use Date in Commerce
11th May 1995
Class [004]
Lubricant and Fuel Products
Lubricants used for reducing heat and friction when cutting, grinding and shaping silicon wafers
First Use Date in General
11th May 1995
First Use Date in Commerce
11th May 1995
Mark Details
Serial Number
No 75858766
Mark Type
No Service/Collective Mark
Attorney Docket Number
No Keteca
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 10th Mar 2022 | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED |
| 10th Mar 2022 | REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS) |
| 10th Mar 2022 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
| 10th Mar 2022 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| 22nd Oct 2021 | TEAS SECTION 8 & 9 RECEIVED |
| 23rd Oct 2020 | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED |
| 01st Jul 2011 | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) |
| 01st Jul 2011 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
| 27th Jun 2011 | TEAS SECTION 8 & 9 RECEIVED |
| 03rd Dec 2007 | REGISTERED - SEC. 8 (6-YR) ACCEPTED |