NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
record initialized not assigned to examiner
on 25 Jun 2024
Last Applicant/ Owned by
Christopher M. Spletzer, Sr.
Fort Washington
PA
19034
Serial Number
98617618 filed on 25th Jun 2024
Registration Number
N/A
Correspondent Address
Christopher M. Spletzer, Sr.
Filing Basis
1. intent to use
2. intent to use current
Disclaimer
NO DATA
K&S
Online platform featuring information and software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging Electronics assembly equipment and consummables and component parts for such equipment, material handling system for electronics assembly equipment, factor Read More
Classification Information
Class [042]
Computer & Software Services & Scientific Services
Online platform featuring information and software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging
First Use Date in General
N/A
First Use Date in Commerce
N/A
Class [009]
Computer & Software Products & Electrical & Scientific Products
Downloadable software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging
First Use Date in General
N/A
First Use Date in Commerce
N/A
Class [007]
Machinery Products
Electronics assembly equipment and consummables and component parts for such equipment, material handling system for electronics assembly equipment, factory automation equipment for electronics assembly, factory automation equipment for semiconductor packaging, semiconductor packaging equipment, material handling system for semiconductor packaging equipment, wire bonding equipment, semiconductor interconnection equipment, stud bumping equipment, semiconductor die attach equipment, flip chip bonding equipment, thermocompression bonding equipment, laser bonding equipment, laser based electronic component transfer and placement equipment, electronic component transfer and placement equipment, ultrasonic welding equipment, clip attach equipment, pick and place equipment, lithographic equipment, fluid dispensing equipment, inspection equipment, wire bonding tools, sonotrodes, die attach tools, semiconductor dicing blades, dispensing equipment consumables, dispensing equipment nozzles
First Use Date in General
N/A
First Use Date in Commerce
N/A
Mark Details
Serial Number
No 98617618
Mark Type
No Service Mark
Attorney Docket Number
No TM-078US
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 25th Jun 2024 | NEW APPLICATION ENTERED |