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K+S
Live/Pending
NON-FINAL ACTION - MAILED

final action

on 16 Dec 2024

Last Applicant/ Owned by

1005 Virginia drive

Fort Washington

PA

19034

Serial Number

98574066 filed on 29th May 2024

Registration Number

N/A

Correspondent Address

Christopher M. Spletzer, Sr.

Filing Basis

1. intent to use

2. intent to use current

Disclaimer

NO DATA

K+S

online platform featuring information and software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging Electronics assembly equipment and consummables and component parts for such equipment, material handling system for electronics assembly equipment, factor Read More

Classification Information


Class [042]
Computer & Software Services & Scientific Services


online platform featuring information and software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging


First Use Date in General

N/A

First Use Date in Commerce

N/A

Class [009]
Computer & Software Products & Electrical & Scientific Products


downloadable software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging


First Use Date in General

N/A

First Use Date in Commerce

N/A

Class [007]
Machinery Products


Electronics assembly equipment and consummables and component parts for such equipment, material handling system for electronics assembly equipment, factory automation equipment for electronics assembly, factory automation equipment for semiconductor packaging, semiconductor packaging equipment, material handling system for semiconductor packaging equipment, wire bonding equipment, semiconductor interconnection equipment, stud bumping equipment, semiconductor die attach equipment, flip chip bonding equipment, thermocompression bonding equipment, laser bonding equipment, laser based electronic component transfer and placement equipment, electronic component transfer and placement equipment, ultrasonic welding equipment, clip attach equipment, pick and place equipment, lithographic equipment, fluid dispensing equipment, inspection equipment, wire bonding tools, sonotrodes, die attach tools, semiconductor dicing blades, dispensing equipment consumables, dispensing equipment nozzles


First Use Date in General

N/A

First Use Date in Commerce

N/A

Mark Details


Serial Number

No 98574066

Mark Type

No Service Mark

Attorney Docket Number

No TM-077US

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

No

66A Current

No

Current Basis

No

No Basis

No

Legal History


Status DateAction Taken
16th Dec 2024NON-FINAL ACTION WRITTEN
16th Dec 2024NOTIFICATION OF NON-FINAL ACTION E-MAILED
16th Dec 2024NON-FINAL ACTION E-MAILED
11th Dec 2024ASSIGNED TO EXAMINER
06th Dec 2024NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
29th May 2024NEW APPLICATION ENTERED