on 24 Dec 2019
Last Applicant/ Owned by
Hyogo-ku, Kobe 652-0806
JP
Serial Number
79260171 filed on 11th Mar 2019
Registration Number
5940894 registered on 24th Dec 2019
Correspondent Address
M. Scott Alprin
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
Chemicals for use in metal plating; metal plating chemical compositions; chemical compositions for metal plating; chemical compositions for nickel plating; chemical compositions for zinc plating; stripping chemicals for removing metal films in the electronics industry; lead-free plating chemicals; wafer bump plating chemicals; chemicals for use in industry; antistatic chemicals for industrial purp Read More
Chemicals for use in metal plating; metal plating chemical compositions; chemical compositions for metal plating; chemical compositions for nickel plating; chemical compositions for zinc plating; stripping chemicals for removing metal films in the electronics industry; lead-free plating chemicals; wafer bump plating chemicals; chemicals for use in industry; antistatic chemicals for industrial purposes; antistatic preparations, other than for household purposes; separating and unsticking preparations in the nature of solvents for use in the electronics industry
N/A
N/A
No 79260171
No Service/Collective Mark
No 0130019
No
No
No
No
Yes
Yes
No
No
Status Date | Action Taken |
---|---|
24th Dec 2024 | COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED |
15th Jan 2021 | CHANGE OF NAME/ADDRESS REC'D FROM IB |
24th Apr 2020 | FINAL DECISION TRANSACTION PROCESSED BY IB |
04th Apr 2020 | FINAL DISPOSITION NOTICE SENT TO IB |
04th Apr 2020 | FINAL DISPOSITION PROCESSED |
24th Mar 2020 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
24th Dec 2019 | REGISTERED-PRINCIPAL REGISTER |
08th Oct 2019 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
08th Oct 2019 | PUBLISHED FOR OPPOSITION |
05th Oct 2019 | NOTIFICATION PROCESSED BY IB |