accepted and acknowledged
on 26 Sep 2024
Last Applicant/ Owned by
7-1, Hazawa 2-chome, Nerima-ku
Tokyo
JP
176-8508
Serial Number
86446449 filed on 06th Nov 2014
Registration Number
5433713 registered on 27th Mar 2018
Correspondent Address
Colleen E. Ferguson
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
coatings used in the manufacture of printed circuit boards, namely, solder resist; photoresists; photoresists, namely, dry film for use with printed circuit boards; chemicals additives for coating materials for use with printed circuit boards; dry film photosensitive polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods; dry film thermosetting polyimide c Read More
insulating resin materials for use with printed circuit boards; insulating coating materials for use with printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards; insulating resin materials for intermediate dielectric materials for use on build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use on build-up boards; coverlay film for use with flexible printed circuits; insulating resin materials for dry film type for use on flexible printed boards
20th May 2015
11th Apr 2017
coatings used in the manufacture of printed circuit boards, namely, solder resist; photoresists; photoresists, namely, dry film for use with printed circuit boards; chemicals additives for coating materials for use with printed circuit boards; dry film photosensitive polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods; dry film thermosetting polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods
20th May 2015
11th Apr 2017
No 86446449
No Service/Collective Mark
No 3T10960
No
No
Yes
Yes
No
No
No
No
Status Date | Action Taken |
---|---|
26th Sep 2024 | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED |
26th Sep 2024 | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. |
26th Sep 2024 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
22nd Mar 2024 | TEAS SECTION 8 & 15 RECEIVED |
27th Mar 2023 | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED |
10th Apr 2018 | ELECTRONIC RECORD REVIEW COMPLETE |
27th Mar 2018 | REGISTERED-PRINCIPAL REGISTER |
17th Feb 2018 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
16th Feb 2018 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
26th Jan 2018 | CORRESPONDENCE RECEIVED IN LAW OFFICE |