on 07 Feb 2023
Last Applicant/ Owned by
Shinagawa-ku Tokyo 141-8584
JP
Serial Number
79313665 filed on 23rd Apr 2021
Registration Number
6970217 registered on 07th Feb 2023
Filing Basis
No Filing Basis
Disclaimer
NO DATA
Both side pure copper laminated boards for use in the manufacture of printed wiring boards intended for use with a built-in condenser; Both side pure copper laminated boards that also contain a built-in condenser for use in the manufacture of printed wiring boards; pure copper foil laminates for use in the manufacture of capacitive printed circuit boards; pure copper foils for use in the manufactu Read More
Both side pure copper laminated boards for use in the manufacture of printed wiring boards intended for use with a built-in condenser; Both side pure copper laminated boards that also contain a built-in condenser for use in the manufacture of printed wiring boards; pure copper foil laminates for use in the manufacture of capacitive printed circuit boards; pure copper foils for use in the manufacture of capacitive printed circuit boards
No 79313665
No Service/Collective Mark
No 199026
No
No
No
No
No
No
No
No
26.17.09 -
Curved line(s), band(s) or bar(s)
27.03.01 -
Geometric figures forming letters or numerals, including punctuation
Status Date | Action Taken |
---|---|
30th May 2023 | FINAL DECISION TRANSACTION PROCESSED BY IB |
08th May 2023 | FINAL DISPOSITION NOTICE SENT TO IB |
08th May 2023 | FINAL DISPOSITION PROCESSED |
07th May 2023 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
07th Feb 2023 | REGISTERED-PRINCIPAL REGISTER |
07th Feb 2023 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
20th Dec 2022 | NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB |
30th Nov 2022 | NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB |
30th Nov 2022 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
22nd Nov 2022 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |