on 01 Mar 2016
Last Applicant/ Owned by
1-2, Shimohozumi 1-chome
Ibaraki-shi, Osaka
JP
Serial Number
76599263 filed on 25th Jun 2004
Registration Number
3047782 registered on 24th Jan 2006
Filing Basis
1. use application currently
Disclaimer
NO DATA
Adhesive protection and fixing tape for semiconductor wafer and electronic device
Adhesive protection and fixing tape for semiconductor wafer and electronic device
21st Jun 2004
21st Jun 2004
No 76599263
No Service/Collective Mark
No 120776NDC003
No
No
No
No
No
No
No
No
Status Date | Action Taken |
---|---|
01st Mar 2016 | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED |
01st Mar 2016 | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) |
01st Mar 2016 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
29th Feb 2016 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
15th Dec 2015 | TEAS SECTION 8 & 9 RECEIVED |
01st Feb 2012 | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. |
01st Feb 2012 | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - MAILED |
31st Jan 2012 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
09th Dec 2011 | TEAS SECTION 8 & 15 RECEIVED |
24th Jan 2006 | REGISTERED-PRINCIPAL REGISTER |