on 06 Jul 2023
Last Applicant/ Owned by
23, Senju Hashido-cho, Adachi-ku
Tokyo
JP
120-8555
Serial Number
76036301 filed on 27th Apr 2000
Registration Number
2678661 registered on 21st Jan 2003
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
Solder, solder paste, solder wire, solder form, solder ball, ingot solder and lead-free solder
Solder, solder paste, solder wire, solder form, solder ball, ingot solder and lead-free solder
03rd Apr 2000
19th Jul 2002
No 76036301
No Service/Collective Mark
No 120776SMI008
No
No
No
No
No
No
No
No
01.07.01 -
Globes with outlines of continents
Status Date | Action Taken |
---|---|
06th Jul 2023 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
06th Jul 2023 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
06th Jul 2023 | REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS) |
06th Jul 2023 | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED |
12th Dec 2022 | TEAS SECTION 8 & 9 RECEIVED |
21st Jan 2022 | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED |
07th Feb 2013 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
07th Feb 2013 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
07th Feb 2013 | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) |
07th Feb 2013 | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED |