Section 71 & 15 – ACCEPTED AND ACKNOWLEDGED
on 27 Jan 2021
Last Applicant/ Owned by
Asahi-cho, Adachi-ku
Tokyo 120-0026
JP
Serial Number
79138412 filed on 14th Aug 2013
Registration Number
4630353 registered on 04th Nov 2014
Correspondent Address
Leonard D. Bowersox
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
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Chemicals for use in industry and science other than for medical or veterinary use; chemicals for welding and soldering purposes; chemical preparations for welding; chemical preparations for soldering; [ metal tempering preparations; chemicals for cleaning printed circuit boards, namely, solvent type processing compositions for use in the electronics industry; chemicals used for anti-tarnishing, p Read More
Classification Information
Class [006]
Metal Products
[ Hard or soft solder bars; ] solder wire; [ solder foil; solder powder; hard or soft solders in the form of washer, ring, pellet, disk, or ribbon; ] hard or soft solders for use in industrial welding; solder paste for use in industrial welding; [ hard or soft solder balls for use in industrial welding; gold ingot solder for use in industrial welding; ] hard or soft solder alloys for use in industrial welding; hard or soft solders containing resin; resin core wire, namely, filamentous solder in which resin flux is filled for use in industrial welding; all of which do not contain lead
First Use Date in General
N/A
First Use Date in Commerce
N/A
Class [001]
Chemical Products
Chemicals for use in industry and science other than for medical or veterinary use; chemicals for welding and soldering purposes; chemical preparations for welding; chemical preparations for soldering; [ metal tempering preparations; chemicals for cleaning printed circuit boards, namely, solvent type processing compositions for use in the electronics industry; chemicals used for anti-tarnishing, plating, soldering, etching, stripping, and deterging metal surfaces for use in the manufacturing of electronic circuit boards, namely, solder mask, etchants for use in the manufacture of printed circuit boards, masking compounds for use in the manufacture of printed circuit boards, doping compounds for use in the manufacture of printed circuit boards, chemical oxidants for use in the manufacture of printed circuits, chemical coatings used in the manufacture of printed circuit boards; surface active chemical agents for use in the manufacture of detergents; ] soldering chemicals; soldering paste; soldering cream; soldering fluxes; [ plastic adhesives not for stationery or household purposes; adhesives for use in industry; ] all of which do not contain lead
First Use Date in General
N/A
First Use Date in Commerce
N/A
Mark Details
Serial Number
No 79138412
Mark Type
No Service/Collective Mark
Attorney Docket Number
No 9090-011
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
Yes
66A Current
Yes
Current Basis
No
No Basis
No
Design Code(s)
24.17.06 -
Plus symbol (+)
26.09.14 -
Three or more squares
26.09.16 -
Squares touching or intersecting
Legal History
| Status Date | Action Taken |
|---|---|
| 27th Sep 2024 | TEAS SECTION 71 RECEIVED |
| 04th Nov 2023 | COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED |
| 24th Aug 2023 | INTERNATIONAL REGISTRATION RENEWED |
| 23rd Jul 2023 | NEW REPRESENTATIVE AT IB RECEIVED |
| 27th Jan 2021 | NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED |
| 27th Jan 2021 | REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK. |
| 20th Jan 2021 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| 22nd Oct 2020 | TEAS SECTION 71 & 15 RECEIVED |
| 04th Nov 2019 | COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED |
| 17th Apr 2015 | FINAL DECISION TRANSACTION PROCESSED BY IB |