CANCELLED - SECTION 8
section 8
on 28 Mar 2009
Last Applicant/ Owned by
Hsinchu Industrial Park
Hsinchu Hsien
TW
Serial Number
75547850 filed on 03rd Sep 1998
Registration Number
2585686 registered on 25th Jun 2002
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
DTI DTI
components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit
Classification Information
Class [009]
Computer & Software Products & Electrical & Scientific Products
components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit
First Use Date in General
31st Mar 1998
First Use Date in Commerce
31st Jul 1999
Mark Details
Serial Number
No 75547850
Mark Type
No Service/Collective Mark
Attorney Docket Number
No
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 28th Mar 2009 | CANCELLED SEC. 8 (6-YR) |
| 09th Mar 2009 | CASE FILE IN TICRS |
| 25th Jun 2002 | REGISTERED-PRINCIPAL REGISTER |
| 18th Apr 2002 | PAPER RECEIVED |
| 08th Mar 2002 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
| 01st Mar 2002 | ASSIGNED TO EXAMINER |
| 04th Feb 2002 | STATEMENT OF USE PROCESSING COMPLETE |
| 04th Feb 2002 | USE AMENDMENT FILED |
| 07th Sep 2001 | EXTENSION 2 GRANTED |
| 20th Aug 2001 | EXTENSION 2 FILED |