CANCELLED - SECTION 8
section 8
on 31 Jan 2009
Last Applicant/ Owned by
Hsinchu Industrial Park
Hsinchu Hsien
TW
Serial Number
75547340 filed on 03rd Sep 1998
Registration Number
2564021 registered on 23rd Apr 2002
Correspondent Address
Shannon T. Vale
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
DTI DAYSHINE TECHNOLOGY INC.
components used in packaging integrated circuits, namely, an insulated wafer and substrata material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit
Classification Information
Class [009]
Computer & Software Products & Electrical & Scientific Products
components used in packaging integrated circuits, namely, an insulated wafer and substrata material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit
First Use Date in General
31st Mar 1998
First Use Date in Commerce
31st Jul 1999
Mark Details
Serial Number
No 75547340
Mark Type
No Service/Collective Mark
Attorney Docket Number
No LLEE:003
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Design Code(s)
27.03.01 -
Geometric figures forming letters or numerals, including punctuation
Legal History
| Status Date | Action Taken |
|---|---|
| 31st Jan 2009 | CANCELLED SEC. 8 (6-YR) |
| 08th May 2007 | CASE FILE IN TICRS |
| 23rd Apr 2002 | REGISTERED-PRINCIPAL REGISTER |
| 15th Apr 2002 | PAPER RECEIVED |
| 11th Dec 2001 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
| 07th Dec 2001 | EXAMINERS AMENDMENT MAILED |
| 29th Nov 2001 | NON-FINAL ACTION MAILED |
| 23rd Nov 2001 | ASSIGNED TO EXAMINER |
| 14th Nov 2001 | PAPER RECEIVED |
| 05th Nov 2001 | STATEMENT OF USE PROCESSING COMPLETE |