REGISTERED AND RENEWED
on 30 Mar 2022
Last Applicant/ Owned by
INDUSTRIAL, COMPLEX
SINGAPORE
SG
347740
Serial Number
75864883 filed on 06th Dec 1999
Registration Number
2508767 registered on 20th Nov 2001
Filing Basis
1. use application currently
Disclaimer
NO DATA
DIAMAFLOW
LUBRICANTS USED FOR REDUCING HEAT AND FRICTION WHEN CUTTING, GRINDING AND SHAPING SILICON WAFERS CHEMICAL SOLUTIONS AND SURFACTANTS USED FOR REDUCING HEAT AND FRICTION WHEN CUTTING, GRINDING AND SHAPING SILICON WAFERS
Classification Information
Class [001]
Chemical Products
CHEMICAL SOLUTIONS AND SURFACTANTS USED FOR REDUCING HEAT AND FRICTION WHEN CUTTING, GRINDING AND SHAPING SILICON WAFERS
First Use Date in General
11th May 1995
First Use Date in Commerce
11th May 1995
Class [004]
Lubricant and Fuel Products
LUBRICANTS USED FOR REDUCING HEAT AND FRICTION WHEN CUTTING, GRINDING AND SHAPING SILICON WAFERS
First Use Date in General
11th May 1999
First Use Date in Commerce
11th May 1999
Mark Details
Serial Number
No 75864883
Mark Type
No Service/Collective Mark
Attorney Docket Number
No Keteca
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 30th Mar 2022 | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED |
| 30th Mar 2022 | REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS) |
| 30th Mar 2022 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
| 15th Mar 2022 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| 05th Nov 2021 | TEAS SECTION 8 & 9 RECEIVED |
| 20th Nov 2020 | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED |
| 01st Jul 2011 | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) |
| 01st Jul 2011 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
| 27th Jun 2011 | TEAS SECTION 8 & 9 RECEIVED |
| 03rd Dec 2007 | REGISTERED - SEC. 8 (6-YR) ACCEPTED |