final action
on 02 Sep 2024
Last Applicant/ Owned by
Minato-ku Tokyo 105-8417
JP
Serial Number
79392793 filed on 30th Jan 2024
Registration Number
N/A
Correspondent Address
Otemon Tower, 1-1-2 Otemachi,
Tokyo 100-8124,
JAPAN
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
Copper and its alloys; copper, unwrought or semi-wrought; copper alloys, unwrought or semi-wrought; copper ingots; copper-base alloy ingots; castings, foils, powder, and rolled, drawn or extruded semi-finished articles of copper or its alloys; foils of copper and its alloys for printed circuit boards; copper strip; copper alloy strip; copper plates; copper alloy plates; sputtering targets of coppe Read More
Treating of copper and its alloys; recycling of copper; recycling of copper contained in waste or used goods; recycling of waste or used goods; sorting of waste, used and recyclable material [transformation]
N/A
N/A
Copper and its alloys; copper, unwrought or semi-wrought; copper alloys, unwrought or semi-wrought; copper ingots; copper-base alloy ingots; castings, foils, powder, and rolled, drawn or extruded semi-finished articles of copper or its alloys; foils of copper and its alloys for printed circuit boards; copper strip; copper alloy strip; copper plates; copper alloy plates; sputtering targets of copper and its alloys; coils made of copper and its alloys
N/A
N/A
No 79392793
No Service Mark
No
No
No
No
No
Yes
Yes
No
No
Status Date | Action Taken |
---|---|
29th Nov 2024 | CHANGE OF NAME/ADDRESS REC'D FROM IB |
21st Sep 2024 | REFUSAL PROCESSED BY IB |
02th Sep 2024 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
02th Sep 2024 | REFUSAL PROCESSED BY MPU |
31st Aug 2024 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
30th Aug 2024 | NON-FINAL ACTION WRITTEN |
23rd Aug 2024 | ASSIGNED TO EXAMINER |
09th Apr 2024 | APPLICATION FILING RECEIPT MAILED |
05th Apr 2024 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
04th Apr 2024 | SN ASSIGNED FOR SECT 66A APPL FROM IB |