on 17 Mar 2020
Last Applicant/ Owned by
Chuo-ku, Osaka-shi Osaka 541-0041
JP
Serial Number
79271932 filed on 13th Aug 2019
Registration Number
6010553 registered on 17th Mar 2020
Correspondent Address
Osaka 530-0005
JAPAN
Filing Basis
No Filing Basis
Disclaimer
NO DATA
Semi-conductors; semiconductor wafers; wafers for integrated circuits; semiconductor substrates; semiconductor devices; electronic circuits; electrical circuit boards; integrated circuits; printed circuits; printed circuit boards
Semi-conductors; semiconductor wafers; wafers for integrated circuits; semiconductor substrates; semiconductor devices; electronic circuits; electrical circuit boards; integrated circuits; printed circuits; printed circuit boards
No 79271932
No Service/Collective Mark
No
No
No
No
No
No
No
No
No
Status Date | Action Taken |
---|---|
15th May 2020 | NOTIFICATION PROCESSED BY IB |
28th Apr 2020 | FINAL DISPOSITION NOTICE SENT TO IB |
28th Apr 2020 | FINAL DISPOSITION PROCESSED |
16th Apr 2020 | GRANT OF PROTECTION CREATED, TO BE SENT TO IB |
17th Mar 2020 | REGISTERED-PRINCIPAL REGISTER |
04th Jan 2020 | NOTIFICATION PROCESSED BY IB |
31st Dec 2019 | PUBLISHED FOR OPPOSITION |
18th Dec 2019 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
18th Dec 2019 | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB |
11th Dec 2019 | NOTICE OF PUBLICATION |